Panel with releasable core

Patent metadata

Field	Value
Publication number	US-9434135-B2
Application number	US-201414227750-A
Country	US
Kind code	B2
Filing date	Mar 27, 2014
Priority date	Dec 19, 2013
Publication date	Sep 6, 2016
Grant date	Sep 6, 2016

Abstract

Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include (1) arranging a mask on a center portion of the panel, the panel including a center stiffener with a first foil attached to a first side of the center stiffener by a first adhesive layer and a second foil attached to a second side of the center stiffener by a second adhesive layer, the first side of the center stiffener opposite the second side of the center stiffener, (2) removing portions of exposed edges of the panel, and (3) removing the mask.

First claim

What is claimed is:

1. A panel comprising:
a substantially rectangular base,
first and second inner foils adhesively coupled to the base, the first inner foil coupled to the base at a first side of the base and the second inner foil coupled to the base at a second side of the base, the second side of the base opposite the first side of the base;
first and second adhesive layers situated on the first and second inner foils respectively; and
first and second outer conductive foils situated on the first and second adhesive layers, respectively,
wherein the first and second inner foils each include a periphery that is substantially flush with a periphery of the base.

2. The panel of claim 1 , wherein the first and second outer conductive foils each include a periphery that is substantially flush with a periphery of the first and second inner foils, respectively.

3. The panel of claim 1 , wherein the first and second outer conductive foils include a width that is smaller than a width of the first and second inner foils, respectively.

4. The panel of claim 1 , wherein the first and second outer conductive foils include a thickness that is less than a thickness of the first and second inner foils, respectively.

5. The panel of claim 4 , wherein the thickness of the first and second outer conductive foils is between about three and six micrometers.

6. The panel of claim 4 , wherein the thickness of the first and second inner foils is between about fifteen and twenty micrometers.

7. The panel of claim 1 , wherein the base includes a carbon impregnated with an epoxy or a resin.

8. The panel of claim 1 , wherein the first and second inner foils include copper, and the first and second outer conductive foils include copper.

9. The panel of claim 1 , further comprising:
first and second substrates situated on the first and second outer conductive foils, respectively.

Assignees

• Intel Corp

Inventors

• Erie Jean-Marie
• Shankar Ravi
• Shen Ching-Ping Janet
• Mulligan Rose

Classifications

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• B32B2264/107

  Ceramic · CPC title

• B32B27/20

  using fillers, pigments, thixotroping agents · CPC title

• B32B15/092

  comprising epoxy resins · CPC title

• Y10T428/31678

  Of metal · CPC title