Metal-clad laminate, method for producing same, and flexible printed board

Patent metadata

Field	Value
Publication number	US-9392689-B2
Application number	US-201113881059-A
Country	US
Kind code	B2
Filing date	Oct 25, 2011
Priority date	Oct 25, 2010
Publication date	Jul 12, 2016
Grant date	Jul 12, 2016

Abstract

A metal-clad laminate, including metal foil, and a first resin layer arranged on the metal foil, the first resin layer including an epoxy resin and a fluoropolymer with a curable functional group. Also disclosed is a method of producing the metal-clad laminate.

First claim

The invention claimed is:

1. A metal-clad laminate, comprising
metal foil, and
a first resin layer arranged on the metal foil,
the first resin layer including an epoxy resin and a fluoropolymer, the fluoropolymer including repeating units having a curable functional group in an amount of 8 to 30 mol % of all repeating units constituting the fluoropolymer,
further comprising a second resin layer arranged on the first resin layer,
wherein the curable functional group is at least one functional group selected from the group consisting of hydroxy groups, carboxyl groups, amino groups, silyl groups, silanate groups, and isocyanate groups,
wherein the second resin layer includes a polyimide,
wherein the mass ratio of the fluoropolymer with a curable functional group and the epoxy resin in the first resin layer is 5:95 to 90:10, and
wherein the fluoropolymer includes at least one repeating unit selected from the group consisting of 2-hydroxyethyl vinyl ether, 3-hydroxypropyl vinyl ether, 2-hydroxypropyl vinyl ether, 2-hydroxy-2-methylpropyl vinyl ether, 4-hydroxybutyl vinyl ether, 4-hydroxy-2-methylbutyl vinyl ether, 5-hydroxypentyl vinyl ether, 6-hydroxyhexyl vinyl ether, 2-hydroxyethyl allyl ether, 4-hydroxybutyl allyl ether, glycerol monoallyl ether, 2-hydroxyethyl acrylate and 2-hydroxyethyl methacrylate.

2. A flexible printed circuit board, comprising
a pattern circuit formed by etching the metal foil of the metal-clad laminate according to claim 1 .

3. A method of producing the metal-clad laminate as claimed in claim 1 , comprising the step of
producing the metal-clad laminate by attaching together the metal foil and a film that includes the epoxy resin and the fluoropolymer with the curable functional group.

4. A method of producing the metal-clad laminate as claimed in claim 1 , comprising the step of
forming the first resin layer by applying to the metal foil a composition that includes the epoxy resin and the fluoropolymer with the curable functional group.

Assignees

• Yamamoto Yoshihisa
• Yoshimoto Hiroyuki
• Nakagawa Hideto
• Daikin Ind Ltd

Inventors

• Yamamoto Yoshihisa
• Yoshimoto Hiroyuki
• Nakagawa Hideto

Classifications

• B32B38/10

  Removing layers, or parts of layers, mechanically or chemically · CPC title

• Y10T428/31522

  Next to metal · CPC title

• B32B15/092

  comprising epoxy resins · CPC title

• B32B37/14

  characterised by the properties of the layers · CPC title

• H05K3/386 Primary

  by the use of an organic polymeric bonding layer, e.g. adhesive · CPC title