Method for manufacturing smart card, smart card, and conductive particle-containing hot-melt adhesive sheet
US-2025250466-A1 · Aug 7, 2025 · US
Memory cards, chip cards
Memory cards, chip cards · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B29L2017/006 |
| Official title | {Memory cards, chip cards} |
| Display label | Memory cards, chip cards |
| Total patents | 54 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 6 |
| 2017 | 5 |
| 2018 | 2 |
| 2019 | 10 |
| 2020 | 5 |
| 2021 | 7 |
| 2022 | 7 |
| 2023 | 1 |
| 2024 | 2 |
| 2025 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for manufacturing smart card
US-12312514-B2 · May 27, 2025 · US
Method for producing a film having a security feature for a card-shaped data carrier, film and card-shaped data carrier
US-2025033265-A1 · Jan 30, 2025 · US
Forming method of water-soluble protective film, and processing method of plate-shaped object
US-2024424743-A1 · Dec 26, 2024 · US
Bonded body, substrate, method for producing bonded body, and method for producing substrate
US-2024092061-A1 · Mar 21, 2024 · US
DI metal transaction devices and processes for the manufacture thereof
US-11618191-B2 · Apr 4, 2023 · US
Method for manufacturing smart card, smart card, and conductive particle-containing hot-melt adhesive sheet
US-2022363953-A1 · Nov 17, 2022 · US
Elevator with debowing mechanism
US-11440239-B2 · Sep 13, 2022 · US
Molded pocket in transaction card construction
US-11285644-B2 · Mar 29, 2022 · US
Overmolded electronic components for transaction cards and methods of making thereof
US-11267172-B2 · Mar 8, 2022 · US
Overmolded electronic components for transaction cards and methods of making thereof
US-11247371-B2 · Feb 15, 2022 · US
Heat-resistant release sheet and thermocompression bonding method
US-2022001582-A1 · Jan 6, 2022 · US
Heat-resistant release sheet and thermocompression bonding method
US-2022001581-A1 · Jan 6, 2022 · US
Molded pocket in transaction card construction
US-2021276234-A1 · Sep 9, 2021 · US
Molded pocket in transaction card construction
US-11034065-B2 · Jun 15, 2021 · US
Di metal transaction devices and processes for the manufacture thereof
US-2021154898-A1 · May 27, 2021 · US
Molded pocket in transaction card construction
US-2021154897-A1 · May 27, 2021 · US
Overmolded electronic components for transaction cards and methods of making thereof
US-2021138705-A1 · May 13, 2021 · US
Molded pocket in transaction card construction
US-10946565-B2 · Mar 16, 2021 · US
Overmolded electronic components for transaction cards and methods of making thereof
US-10926439-B2 · Feb 23, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B29L2017/006?
- CPC B29L2017/006 is the Cooperative Patent Classification code for “Memory cards, chip cards.”
- How many patents are filed under CPC B29L2017/006 (Memory cards, chip cards)?
- Our database includes 54 publications tagged with this CPC code.
- Is patent activity under CPC B29L2017/006 growing?
- Publication counts under this code: 2 in 2024 vs 3 in 2025 (latest complete years).