Overmolded electronic components for transaction cards and methods of making thereof

Patent metadata

Field	Value
Publication number	US-11267172-B2
Application number	US-201716320597-A
Country	US
Kind code	B2
Filing date	Jul 26, 2017
Priority date	Jul 27, 2016
Publication date	Mar 8, 2022
Grant date	Mar 8, 2022

Abstract

A process for manufacturing a transaction card includes forming an opening in a card body of the transaction card; inserting an electronic component into the opening; and molding a molding material about the electronic component. A transaction card includes a molded electronic component.

First claim

What is claimed:

1. A process for manufacturing a transaction card comprising the steps of:
forming an opening in a card body of the transaction card;
inserting an electronic component into the opening; and
molding a molding material about the electronic component;
wherein the molding step comprises placing the electronic component into a mold and injecting the molding material into the mold, and
wherein the inserting step occurs after the molding step.

2. The process of claim 1 further comprising the step of forming one or more securing features in the card body for securing the molding material to the card body.

3. The process of claim 2 , wherein the securing features comprise pockets in the card body.

4. The process of claim 1 , wherein the opening extends partially or entirely through the card body.

5. The process of claim 1 , wherein the molding material is a plastic having a molding temperature range of approximately 150-300 C.

6. The process of claim 1 , wherein the molding material comprises a polymeric molding material, the polymeric molding material comprising one or more of EVA, metallocene polyalphaolefins, polyolefins including atactic polyalphaolefins, block copolymers, polyurethane hot melts, polyamides, fiberglass reinforced polyester, polyurethane, bakelite, duroplast, melamine, Diallyl-phthalate, and polyimide.

7. The process of claim 1 , wherein the molding material comprises a metallic molding material, the metallic molding material comprising one or more of Rhodium, Aluminum, Titanium, Magnesium, Copper, Brass, Nickel, Monel, Inconel, Steels and alloys of the above.

8. The process of claim 1 further comprising, after the molding step, the step of removing excess molding material from the molded electronic component.

9. The process of claim 1 , wherein the opening is a pocket in the card body and the molding step comprises molding a molding material onto at least a top surface of the electronic component.

10. A transaction card manufactured according to the process of claim 1 .

Assignees

• Composecure Llc

Inventors

• Lowe Adam

Classifications

• G06K19/07794

  the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit · CPC title

• G06K19/077

  Constructional details, e.g. mounting of circuits in the carrier · CPC title

• H05K2201/1003

  Non-printed inductor · CPC title

• G06K19/07749

  the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card · CPC title

• B22D19/00

  Casting in, on, or around objects which form part of the product (B22D23/04 takes precedence; alumino-thermic welding B23K23/00; coating by casting molten material on the substrate C23C6/00) · CPC title