Molded pocket in transaction card construction

Patent metadata

Field	Value
Publication number	US-10946565-B2
Application number	US-201816230606-A
Country	US
Kind code	B2
Filing date	Dec 21, 2018
Priority date	Oct 14, 2015
Publication date	Mar 16, 2021
Grant date	Mar 16, 2021

Abstract

Methods and apparatuses are provided for manufacturing a transaction card. The disclosed methods and apparatuses may be used to form a transaction card frame within a mold. The transaction card frame may include one or more recessed portions formed within a first surface of the transaction card frame. The one or more recessed portions may be configured for affixing one or more electronic components.

First claim

What is claimed is:

1. A mold for molding a transaction card, comprising:
a first plate and a second plate, wherein when the first plate and the second plate are joined together, the first plate and the second plate forming a cavity for receiving a material for forming a transaction card frame,
wherein the first plate and the second plate of the mold include structures that define a shape and dimension of at least one recessed portion to be formed within a surface of the transaction card frame, the at least one recessed portion configured for affixing at least one electronic component,
wherein the first plate includes a protrusion structure that defines the shape and dimension of the at least one recessed portion, wherein the protrusion structure includes a protrusion portion protruding a distance from a surface of the first plate,
wherein the first plate includes a gate for receiving the material for forming the transaction card frame, the gate disposed on the protrusion portion at a location corresponding to a location of the at least one recessed portion to be formed.

2. The mold of claim 1 , wherein the first plate includes a through hole for receiving a pin for removing the transaction card frame, the through hole being disposed on a surface of the protrusion structure at a location corresponding to a location of the at least one recessed portion to be formed.

3. The mold of claim 1 , wherein the second plate includes a through hole for receiving a pin for removing the transaction card frame, the through hole being disposed at a location corresponding to a location on the transaction card frame for affixing a magnetic strip.

4. The mold of claim 1 , wherein the second plate includes a gate for receiving the material for forming the transaction card frame, the gate being disposed at a location corresponding to a location on the transaction card frame for affixing a magnetic strip.

5. The mold of claim 1 , wherein the protrusion portion is a first protrusion portion and the distance is a first distance, the protrusion structure including a second protrusion portion protruding a second distance from the surface of the first plate, the second distance being greater than the first distance.

6. The mold of claim 3 , wherein the through hole is configured to receive a pin that leaves a mark on the transaction card frame, the mark being removable by subsequent milling.

7. The mold of claim 4 , wherein the gate leaves a mark on the transaction card frame and the gate is configured to allow steps for removing the mark by a subsequent milling step.

8. The mold of claim 1 , wherein the electronic component is at least one of: an EMV chip, a communication device, a barcode, and a Quick Response code.

9. The mold of claim 5 , wherein the first distance is 0.19-0.23 mm, and the second distance is 0.60-0.64 mm.

10. A mold for molding a transaction card, comprising:
a first plate and a second plate, wherein the first plate and the second plate are joinable, the first plate and the second plate forming a cavity, when joined, for receiving a material for forming a transaction card frame,
wherein the first plate and the second plate of the mold include structures that define a shape and dimension of at least one recessed portion, including a recessed surface, to be formed on the transaction card frame, the at least one recessed portion configured for affixing at least one electronic component,
wherein the first plate includes a protrusion structure that defines the shape and dimension of the at least one recessed portion,
wherein the protrusion structure includes a protrusion portion protruding a distance from a surface of the first plate, and
wherein the first plate includes a gate for receiving the material for forming the transaction card frame, the gate disposed on the protrusion portion at a location corresponding to a location of the at least one recessed portion to be formed.

11. The mold of claim 10 , wherein the protrusion portion includes a first surface corresponding to a first recessed surface of the at least one recessed portion of the transaction card frame.

12. The mold of claim 11 , wherein the protrusion portion includes a second surface corresponding to a second recessed surface of the at least one recessed portion of the transaction card frame.

13. The mold of claim 10 , wherein the pin received through the through hole leaves a mark on the transaction card frame, wherein the through hole is disposed on the second protrusion portion.

14. The mold of claim 10 , wherein the gate leaves a mark on the transaction card frame, the mark being removable by subsequent milling.

15. The mold of claim 10 , wherein the first plate and the second plate are separable to allow removal of a molded transaction card frame.

16. The mold of claim 10 , wherein the cavity is for receiving a material to be compressed between the first plate and the second plate, the material being either a thermoplastic or a thermosetting polymer.

Assignees

• Capital One Services Llc

Inventors

• Cepress Carl Alexander
• ONG Elwin Ching Yee

Classifications

• B29C45/37 Primary

  Mould cavity walls {, i.e. the inner surface forming the mould cavity, e.g. linings} · CPC title

• B29C43/50

  Removing moulded articles · CPC title

• B29C2045/4063

  preventing damage to articles caused by the ejector · CPC title

• B29C2043/503

  using ejector pins, rods · CPC title

• B29C45/4005

  Ejector constructions; Ejector operating mechanisms (B29C45/44 takes precedence) · CPC title