Elevator with debowing mechanism

US11440239B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11440239-B2
Application numberUS-202016881789-A
CountryUS
Kind codeB2
Filing dateMay 22, 2020
Priority dateJun 12, 2015
Publication dateSep 13, 2022
Grant dateSep 13, 2022

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

Techniques are described herein for reducing bowing effects on a substrate while the substrate is being transported, for example in an elevator mechanism, from a first travel path to a second travel path, where the first travel path is offset from the second travel path so that the first travel path is not collinear with the second travel path. The substrate can be any substrate that is bowed and for which one wishes to eliminate or reduce the bow. One specific substrate that can benefit from the techniques described herein are personalized documents such as plastic cards including but not limited to financial (e.g. credit and debit) cards, drivers' licenses, national identification cards, gift cards, loyalty cards, employee badges, and other plastic cards which bear personalized data unique to the card holder and/or which bear other card or document information.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of debowing a card, comprising: bending the card in a direction opposite of a bow that is present in the card while the card is being transported from a first card travel path to a second card travel path, where the first card travel path is offset from the second card travel path so that the first card travel path is not collinear with the second card travel path. 2. The method of claim 1 , comprising debowing the card while the card is positioned in an elevator mechanism that is movable between the first card travel path and the second card travel path to transport the card from the first card travel path to the second card travel path. 3. The method of claim 2 , wherein the first card travel path is substantially parallel to the second card travel path, and the elevator mechanism is movable in a direction that is substantially perpendicular to the first card travel path and the second card travel path. 4. The method of claim 1 , wherein bending the card comprises: contacting a first side surface of the card with four conical rollers, the conical rollers contacting the first side surface adjacent to corners of the card; contacting a second side surface of the card with two rollers, the second side surface is opposite the first side surface, the two rollers contacting the second side surface adjacent to a center of the second side surface; and moving the four conical rollers and the two rollers relative to one another in a movement direction that is substantially perpendicular to the first and second side surfaces to cause the card to bend. 5. The method of claim 1 , wherein the first card travel path is an auxiliary card travel path along which the card is printed on, and the second card travel path is a primary card travel path. 6. The method of claim 1 , wherein the bending of the card occurs after performing a heat processing operation on the card. 7. The method of claim 6 , wherein the heat processing operation comprises a lamination process. 8. The method of claim 6 , wherein the heat processing operation comprises a retransfer printing operation.

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What does patent US11440239B2 cover?
Techniques are described herein for reducing bowing effects on a substrate while the substrate is being transported, for example in an elevator mechanism, from a first travel path to a second travel path, where the first travel path is offset from the second travel path so that the first travel path is not collinear with the second travel path. The substrate can be any substrate that is bowed a…
Who is the assignee on this patent?
Entrust Corp
What technology area does this patent fall under?
Primary CPC classification B29C53/18. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Sep 13 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).