Overmolded electronic components for transaction cards and methods of making thereof

Patent metadata

Field	Value
Publication number	US-11247371-B2
Application number	US-202117151390-A
Country	US
Kind code	B2
Filing date	Jan 18, 2021
Priority date	Jul 27, 2016
Publication date	Feb 15, 2022
Grant date	Feb 15, 2022

Abstract

A transaction card having an opening in a metal card body, a booster antenna in the opening, and a molding material about the booster antenna. A process for manufacturing the transaction card includes forming an opening in a card body, inserting a booster antenna into the opening, and molding a molding material about the booster antenna.

First claim

What is claimed:

1. A transaction card, comprising:
a first metal layer having an opening configured to receive a DI chip and at least a first aperture connected to the opening;
a second metal layer having a second aperture; and
at least one embedded electronic component between the first and second metal layers.

2. The transaction card of claim 1 , wherein the at least one electronic component comprises an antenna configured to inductively couple with the DI chip.

3. The transaction card of claim 1 , wherein the first aperture comprises a slit defined between a peripheral edge of the card and the opening.

4. The transaction card of claim 1 , comprising an insert in the second aperture in the second metal layer.

5. The transaction card of claim 1 , wherein the first layer, the second layer, and the at least one embedded component are laminated together.

6. The transaction card of claim 1 , wherein material from a lamination layer fills at least a portion of the at least one first aperture.

7. The transaction card of claim 6 , wherein the material from the lamination is transparent.

8. The transaction card of claim 7 , wherein one portion of the at least one first aperture contains the transparent material and at least another portion of the at least one first aperture contains non-transparent material.

9. The transaction card of claim 2 , wherein the antenna is disposed in a transparent window.

10. The transaction card of claim 5 , wherein the insert comprises a non-transparent material.

11. The transaction card of claim 10 , wherein the non-transparent material is disposed flush with a first surface of the first metal layer.

12. The transaction card of claim 10 , wherein the non-transparent material protrudes into the at least one first aperture.

13. The transaction card of claim 10 , wherein a different visual appearance of the non-transparent material relative to the body comprises a difference in color, texture, reflectance, opacity, and combinations thereof.

14. The transaction card of claim 4 , wherein the insert comprises a transparent material and a non-transparent material.

15. The transaction card of claim 4 , wherein the insert comprises a transparent material with decorative printed content.

16. The transaction card of claim 3 , wherein the slit is continuous and comprises a first portion filled with a first material and a second portion filled with a second material, wherein the second material is different from the first material.

17. The transaction card of claim 1 , wherein the first metal layer defines a front-facing surface and the second metal layer defines a back-facing surface.

18. The transaction card of claim 1 , wherein the at least one first aperture defines a first area that is less than a second area of the first metal layer.

19. A transaction card, comprising:
a first metal layer having an opening configured to receive a DI chip and at least a first aperture connected to the opening;
a second metal layer having a second aperture;
at least one embedded electronic component between the first and second metal layers; and
a transparent window formed within the first metal layer.

20. A method for manufacturing a transaction card, comprising:
providing a first metal layer having an opening and at least a first aperture connected to the opening;
providing a second metal layer having a second aperture;
molding a molding material about at least one electronic component, wherein the at least one electronic component comprises an antenna configured to inductively couple with a DI chip;
laminating the molded electronic component between the first and second metal layers; and
providing a transparent window formed in the first metal layer.

21. The method of claim 20 , further comprising inserting the DI chip into the opening.

Assignees

• Composecure Llc

Inventors

• Lowe Adam

Classifications

• G06K19/07794

  the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit · CPC title

• H05K3/285

  Permanent coating compositions · CPC title

• B29C45/14639

  for obtaining an insulating effect, e.g. for electrical components · CPC title

• H05K2203/1327

  Moulding over PCB locally or completely · CPC title

• B29C45/14647 Primary

  Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards · CPC title