Molded pocket in transaction card construction

Patent metadata

Field	Value
Publication number	US-11034065-B2
Application number	US-201916432455-A
Country	US
Kind code	B2
Filing date	Jun 5, 2019
Priority date	Oct 14, 2015
Publication date	Jun 15, 2021
Grant date	Jun 15, 2021

Abstract

Methods and apparatuses are provided for manufacturing a transaction card. The disclosed methods and apparatuses may be used to form a transaction card frame within a mold. The transaction card frame may include one or more recessed portions formed within a first surface of the transaction card frame. The one or more recessed portions may be configured for affixing one or more electronic components.

First claim

What is claimed is:

1. A method of manufacturing a transaction card, the method comprising:
placing a heated material for forming a transaction card frame into a cavity of a mold, the mold comprising a protrusion on a surface of the mold to form at least one recessed portion in the transaction card frame, wherein the mold comprises a first through hole and a second through hole, and wherein the at least one recessed portion in the transaction card frame includes a first surface recessed a first depth from an outer surface and a second surface recessed a second depth from the first surface;
compressing the heated material with the mold to form the transaction card frame including the at least one recessed portion;
cooling the mold;
extending a first pin through the first through hole and a second pin through the second through hole to release the transaction card frame from the mold, wherein a first mark is left in the at least one recessed portion by the pin and a second mark is left on an outer surface of the transaction card frame;
installing an electronic component into the at least one recessed portion, wherein the electronic component comprises a transaction card microchip to cover the first mark; and
applying a magnetic strip to the transaction card frame to cover the second mark.

2. The method of claim 1 , wherein the first depth is 0.19-0.23 mm, and the second depth is 0.60-0.64 mm.

3. The method of claim 1 , wherein the transaction card frame comprises a front surface and a rear surface, wherein a structure on a surface of the cavity comprises structures to form the at least one recessed portion.

4. The method of claim 3 , wherein the structure comprises one or more protrusion portions that define the shape and dimension of the cavity.

5. The method of claim 1 , further comprising milling material from an interior of the at least one recessed portion.

6. The method of claim 1 , further comprising forming a recessed surface in the outer surface of the transaction card frame by cutting or milling.

7. The method of claim 1 , wherein the mold comprises a first plate and a second plate that are joinable, and wherein the cavity is formed between the first plate and the second plate when the first plate and the second plate are joined.

8. The method of claim 7 , wherein the first plate comprises a first protrusion that defines the at least one recessed portion.

9. The method of claim 7 , wherein the second plate comprises a second protrusion that defines the at least one recessed portion.

10. The method of claim 8 , wherein the first through hole for receiving the first pin is disposed in the first plate at a location corresponding to the first protrusion.

11. The method of claim 9 , wherein the first through hole for receiving the pin is disposed in the second plate at a location corresponding to the second protrusion.

12. The method of claim 8 , wherein
the first through hole receives the first pin and the first through hole being disposed at a location corresponding to the first protrusion.

13. The method of claim 9 , further comprising:
removing the second mark left by the second pin on the transaction card frame.

14. The method of claim 12 , wherein
the second through hole receives the second pin, wherein the second through hole is disposed at a location corresponding to the second protrusion.

Assignees

• Capital One Services Llc

Inventors

• Cepress Carl Alexander
• ONG Elwin Ching Yee

Classifications

• B29C45/37 Primary

  Mould cavity walls {, i.e. the inner surface forming the mould cavity, e.g. linings} · CPC title

• B29C45/4005

  Ejector constructions; Ejector operating mechanisms (B29C45/44 takes precedence) · CPC title

• B29C2045/4063

  preventing damage to articles caused by the ejector · CPC title

• B29L2017/006

  Memory cards, chip cards · CPC title

• G06K19/07743

  External electrical contacts · CPC title