Method for manufacturing an interior component for vehicles
US-2024316842-A1 · Sep 26, 2024 · US
Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B29C45/14647 |
| Official title | {Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards} |
| Display label | Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards |
| Total patents | 41 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 1 |
| 2017 | 3 |
| 2018 | 1 |
| 2019 | 12 |
| 2020 | 3 |
| 2021 | 11 |
| 2022 | 6 |
| 2023 | 1 |
| 2024 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Electronic device member of metallic structure and non-metallic structure, and method for manufacturing same
US-12064907-B2 · Aug 20, 2024 · US
DI metal transaction devices and processes for the manufacture thereof
US-11618191-B2 · Apr 4, 2023 · US
Encapsulation assembly for glass, encapsulated glass and manufacturing method thereof
US-2022408583-A1 · Dec 22, 2022 · US
Protection from metal migration on IC packages
US-11417541-B2 · Aug 16, 2022 · US
Molded pocket in transaction card construction
US-11285644-B2 · Mar 29, 2022 · US
Vehicle-integrated lidar system
US-2022091270-A1 · Mar 24, 2022 · US
Overmolded electronic components for transaction cards and methods of making thereof
US-11267172-B2 · Mar 8, 2022 · US
Overmolded electronic components for transaction cards and methods of making thereof
US-11247371-B2 · Feb 15, 2022 · US
Electronic device member of metallic structure and non-metallic structure, and method for manufacturing same
US-2021347098-A1 · Nov 11, 2021 · US
Molded pocket in transaction card construction
US-2021276234-A1 · Sep 9, 2021 · US
Encapsulating electronics in high-performance thermoplastics
US-11034068-B2 · Jun 15, 2021 · US
Molded pocket in transaction card construction
US-11034065-B2 · Jun 15, 2021 · US
Manufacturing implantable tissue stimulators
US-2021170184-A1 · Jun 10, 2021 · US
Di metal transaction devices and processes for the manufacture thereof
US-2021154898-A1 · May 27, 2021 · US
Molded pocket in transaction card construction
US-2021154897-A1 · May 27, 2021 · US
Overmolded electronic components for transaction cards and methods of making thereof
US-2021138705-A1 · May 13, 2021 · US
Molded pocket in transaction card construction
US-10946565-B2 · Mar 16, 2021 · US
Protection from metal migration on ic packages
US-2021066092-A1 · Mar 4, 2021 · US
Overmolded electronic components for transaction cards and methods of making thereof
US-10926439-B2 · Feb 23, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B29C45/14647?
- CPC B29C45/14647 is the Cooperative Patent Classification code for “Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards.”
- How many patents are filed under CPC B29C45/14647 (Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards)?
- Our database includes 41 publications tagged with this CPC code.
- Is patent activity under CPC B29C45/14647 growing?
- Publication counts under this code: 1 in 2023 vs 2 in 2024 (latest complete years).