Encapsulating electronics in high-performance thermoplastics

Patent metadata

Field	Value
Publication number	US-11034068-B2
Application number	US-201815966950-A
Country	US
Kind code	B2
Filing date	Apr 30, 2018
Priority date	Apr 30, 2018
Publication date	Jun 15, 2021
Grant date	Jun 15, 2021

Abstract

An encapsulation for electronics is provided. The encapsulation includes a circuit card assembly (CCA) on which a component of the electronics is operably disposed, a compliant thermal buffer coating (TBC), thermoset material and high-performance thermoplastic materials. The compliant TBC is layered over the component and a first area of the CCA, which extends about a periphery of the component. The thermoset material is cast over the compliant TBC and a second area of the CCA, which extends about a periphery of the compliant TBC. The high-performance thermoplastic material is injection molded over the thermoset material and a third area of the CCA, which extends about a periphery of the thermoset material.

First claim

What is claimed is:

1. An encapsulation for electronics, comprising:
a circuit card assembly (CCA) on which a component of the electronics is operably disposed;
a compliant thermal buffer coating (TBC) layered over the component and a first area of the CCA, which extends about a periphery of the component;
a thermoset material cast over the compliant TBC and a second area of the CCA, which extends about a periphery of the compliant TBC; and
a high-performance thermoplastic material injection molded over the thermoset material and a third area of the CCA, which extends about a periphery of the thermoset material, wherein the high-performance thermoplastic material is injection molded to form fillets that are tapered to exhibit decreased thickness with increasing distance from an encapsulation center.

2. The encapsulation for electronics according to claim 1 , wherein:
the compliant TBC comprises rubberized material and provides for coefficient of thermal (CTE) mismatch compliance between the component and the thermoset material,
the thermoset material comprises a low-temperature, high-compressive strength thermoset material, and
the high-performance thermoplastic material comprises a high-performance thermoplastic that has a melting temperature of at least 500° F. and an injection molding pressure of at least 7,500 psi.

3. The encapsulation for electronics according to claim 1 , wherein:
the CCA defines sectors at opposite sides of the CCA, and
the component is provided as a number of components, each of which is operably disposed on the CCA in one of the sectors at each of the opposite sides of the CCA.

4. The encapsulation for electronics according to claim 3 , wherein the number of the sectors is two.

5. The encapsulation for electronics according to claim 3 , wherein:
the compliant TBC is layered over each of the components and first areas of the CCA, which extend about respective peripheries of each of the components, in each sector at each of the opposite sides of the CCA,
the thermoset material is cast over the compliant TBC and second areas of the CCA, which extend about respective peripheries of the compliant TBC, in each sector at each of the opposite sides of the CCA, and
the high-performance thermoplastic material is injection molded over the thermoset material and third areas of the CCA, which extend about respective peripheries of the thermoset material, in each sector at each of the opposite sides of the CCA.

6. A sensor, comprising:
a CCA defining sectors at opposite sides of the CCA;
electronic components operably disposed on the CCA in each sector at each of the opposite sides of the CCA;
a compliant thermal buffer coating (TBC) layered over each of the electronic components and first areas of the CCA, which extend about respective peripheries of the electronic components, in each sector at each of the opposite sides of the CCA;
a thermoset material cast over the compliant TBC and second areas of the CCA, which extend about respective peripheries of the compliant TBC, in each sector at each of the opposite sides of the CCA; and
a high-performance thermoplastic material injection molded over the thermoset material and third areas of the CCA, which extend about respective peripheries of the thermoset material, in each sector at each of the opposite sides of the CCA, wherein the high-performance thermoplastic material is injection molded to form fillets that are tapered to exhibit decreased thickness with increasing distance from an encapsulation center.

7. The sensor according to claim 6 , wherein:
the compliant TBC comprises rubberized material and provides for coefficient of thermal (CTE) mismatch compliance between the component and the thermoset material,
the thermoset material comprises a low-temperature, high-compressive strength thermoset material, and
the high-performance thermoplastic material comprises high-performance thermoplastic that has a melting temperature of at least 500° F. and an injection molding pressure of at least 7,500 psi.

8. A method of forming an encapsulation for a component of electronics operably disposed on a circuit card assembly (CCA), the method comprising:
layering a compliant thermal buffer coating (TBC) over the component and a first area of the CCA, which extends about a periphery of the component;
casting thermoset material over the compliant TBC and a second area of the CCA, which extends about a periphery of the compliant TBC;
forming a mold; and
injection molding high-performance thermoplastic material in the mold over the thermoset material and a third area of the CCA, which extends about a periphery of the thermoset material,
wherein the forming of the mold comprises forming fillet molding portions to form fillets of the high-performance thermoplastic material that are tapered to exhibit decreased thickness with increasing distance from an encapsulation center.

9. The method according to claim 8 , wherein:
the compliant TBC comprises rubberized material and provides for coefficient of thermal (CTE) mismatch compliance between the component and the thermoset material,
the thermoset material comprises a low-temperature, high-compressive strength thermoset material, and
the high-performance thermoplastic material comprises high-performance thermoplastic that has a melting temperature of at least 500° F. and an injection molding pressure of at least 7,500 psi.

10. The method according to claim 8 , further comprising:
arranging the CCA to define sectors at opposite sides of the CCA, and
providing the component as a number of components, each of which is operably disposed on the CCA in each sector at each of the opposite sides of the CCA.

11. The method according to claim 10 , further comprising:
supporting the CCA such that one sector at one of the opposite sides of the CCA faces upwardly;
completing the layering and the casting in the one sector at the one of the opposite sides of the CCA facing upwardly;
rotating the CCA such that a next sector at the other of the opposite sides of the CCA faces upwardly; and
completing the layering and the casting in the next sector at the other of the opposite sides of the CCA facing upwardly.

12. The method according to claim 11 , wherein the supporting comprises supporting the CCA at tips thereof.

13. The method according to claim 11 , further comprising completing the injection molding in each sector at each of the opposite sides of the CCA simultaneously in the mold.

14. The method according to claim 13 , wherein the forming of the mold comprises forming the fillet molding portions in each sector to form the fillets of the high-performance thermoplastic material.

Assignees

• Raytheon Co

Inventors

• Merems Paul A
• Gritters Darin M

Classifications

• B29C45/14647 Primary

  Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards · CPC title

• B29C70/70

  Completely encapsulating inserts {(B29C70/86 takes precedence)} · CPC title

• B29K2101/12

  Thermoplastic materials · CPC title

• G01D11/245

  Housings for sensors · CPC title

• B29K2271/00

  Use of polyethers {, e.g. PEEK, i.e. polyether-etherketone or PEK, i.e. polyetherketone or derivatives thereof,} as reinforcement · CPC title