Cylindrical grinding device, cylindrical grinding method, and wafer manufacturing method
US-2026001186-A1 · Jan 1, 2026 · US
by ultrasonic cutting (using abrading substances or abrading tools subjected to a bouncing action by ultrasonic energy B24B1/04)
by ultrasonic cutting (using abrading substances or abrading tools subjected to a bouncing action by ultrasonic energy B24B1/04) · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B28D5/047 |
| Official title | {by ultrasonic cutting (using abrading substances or abrading tools subjected to a bouncing action by ultrasonic energy B24B1/04)} |
| Display label | by ultrasonic cutting (using abrading substances or abrading tools subjected to a bouncing action by ultrasonic energy B24B1/04) |
| Total patents | 51 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 2 |
| 2017 | 2 |
| 2019 | 9 |
| 2020 | 4 |
| 2021 | 9 |
| 2022 | 11 |
| 2023 | 4 |
| 2024 | 2 |
| 2025 | 5 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Wafer production system and wafer manufacturing method
US-12486187-B2 · Dec 2, 2025 · US
Processing method and processing apparatus for ingot
US-12427604-B2 · Sep 30, 2025 · US
Peeling method and peeling apparatus
US-12304110-B2 · May 20, 2025 · US
Peeling apparatus
US-12296502-B2 · May 13, 2025 · US
Method of manufacturing wafer and separating apparatus
US-2025010519-A1 · Jan 9, 2025 · US
Cutting method
US-12097633-B2 · Sep 24, 2024 · US
Production method of wafer
US-11890783-B2 · Feb 6, 2024 · US
Peeling apparatus
US-2023373129-A1 · Nov 23, 2023 · US
Wafer production system and wafer manufacturing method
US-2023331614-A1 · Oct 19, 2023 · US
Wafer manufacturing method
US-2023321871-A1 · Oct 12, 2023 · US
Sound-assisted crack propagation for semiconductor wafering
US-2023102291-A1 · Mar 30, 2023 · US
Peeling apparatus
US-2022410431-A1 · Dec 29, 2022 · US
Processing method and processing apparatus for ingot
US-2022395931-A1 · Dec 15, 2022 · US
Peeling method and peeling apparatus
US-2022379520-A1 · Dec 1, 2022 · US
Silicon wafer forming method
US-11511374-B2 · Nov 29, 2022 · US
Sound-assisted crack propagation for semiconductor wafering
US-11504882-B2 · Nov 22, 2022 · US
Method for producing wafers using ultrasound
US-11446771-B2 · Sep 20, 2022 · US
Severing machine
US-2022241900-A1 · Aug 4, 2022 · US
Semiconductor substrate singulation systems and related methods
US-11373859-B2 · Jun 28, 2022 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B28D5/047?
- CPC B28D5/047 is the Cooperative Patent Classification code for “by ultrasonic cutting (using abrading substances or abrading tools subjected to a bouncing action by ultrasonic energy B24B1/04).”
- How many patents are filed under CPC B28D5/047 (by ultrasonic cutting (using abrading substances or abrading tools subjected to a bouncing action by ultrasonic energy B24B1/04))?
- Our database includes 51 publications tagged with this CPC code.
- Is patent activity under CPC B28D5/047 growing?
- Publication counts under this code: 2 in 2024 vs 5 in 2025 (latest complete years).