Cutting method

Patent metadata

Field	Value
Publication number	US-12097633-B2
Application number	US-202117392505-A
Country	US
Kind code	B2
Filing date	Aug 3, 2021
Priority date	Aug 21, 2020
Publication date	Sep 24, 2024
Grant date	Sep 24, 2024

Abstract

Provided is a cutting method of cutting a workpiece by using a cutting apparatus including a chuck table configured to hold the workpiece and a cutting unit having a cutting blade configured to cut the workpiece held by the chuck table and an ultrasonic vibrator configured to ultrasonically vibrate the cutting blade in a radial direction of the cutting blade. The cutting method includes a holding step of holding the workpiece by the chuck table, and a cutting step of performing ultrasonic cutting that cuts the workpiece by the cutting blade vibrated ultrasonically and normal cutting that cuts the workpiece by the cutting blade not vibrated ultrasonically on the same cutting line of a plurality of cutting lines set on the workpiece.

First claim

What is claimed is:

1. A cutting method of cutting a semiconductor wafer workpiece, the cutting method comprising:
a providing step of providing a cutting apparatus including a chuck table configured to hold the workpiece and a cutting unit having a cutting blade configured to cut the workpiece held by the chuck table and an ultrasonic vibrator configured to ultrasonically vibrate the cutting blade in a radial direction of the cutting blade;
a holding step of holding the workpiece by the chuck table;
a cutting step of performing ultrasonic cutting that cuts the workpiece by the cutting blade vibrated ultrasonically and a rotational cutting that cuts the workpiece by the cutting blade not vibrated ultrasonically on a plurality of cutting lines set on the workpiece, each cutting line of the plurality of cutting lines extending in one of an X-axis direction and a Y-axis direction, each cutting line of the plurality of cutting lines having a first portion extending from a first position to a predetermined position and a second portion extending from the predetermined position to a second position; and
wherein, in the cutting step, the ultrasonic cutting is performed in each of the first portions, and the rotational cutting is performed in each of the second portions; and
wherein the first portion and the second portion extend along the same axis extending in one of the X-axis direction or Y-axis direction.

2. The cutting method according to claim 1 , wherein
in the cutting step, the ultrasonic cutting is performed in the first portion extending from the first position to the predetermined position on a selected cutting line of the plurality of cutting lines, ultrasonic vibration of the cutting blade is stopped, and the rotational cutting is performed in the second portion extending from the predetermined position to the second position on the selected cutting line of the plurality of cutting lines without moving the cutting blade in an indexing feed direction.

3. The cutting method according to claim 2 , wherein
after the cutting step is completed for the selected cutting line of the plurality of cutting lines, the cutting step is repeated for a second selected_cutting line of the plurality of the cutting lines.

4. The cutting method according to claim 1 , wherein
in the cutting step, the ultrasonic cutting is first performed in the each of the first portions of the plurality of cutting lines, and then the rotational cutting is next performed in each of the second portions of the plurality of cutting lines.

Assignees

• Disco Corp

Inventors

• Okamura Takashi
• Harada Shigenori

Classifications

• H10P54/00 Primary

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• B28D5/047

  by ultrasonic cutting (using abrading substances or abrading tools subjected to a bouncing action by ultrasonic energy B24B1/04) · CPC title

• B26D2011/005

  in combination with different kind of cutters, e.g. two serial slitters in combination with a transversal cutter · CPC title

• B28D5/022

  by cutting with discs or wheels · CPC title