Peeling method and peeling apparatus

Patent metadata

Field	Value
Publication number	US-12304110-B2
Application number	US-202217664478-A
Country	US
Kind code	B2
Filing date	May 23, 2022
Priority date	May 25, 2021
Publication date	May 20, 2025
Grant date	May 20, 2025

Abstract

An ultrasonic wave is applied to an upper surface of an ingot via a liquid layer, in a state in which an outer circumferential region of a lower surface of the ingot is sucked. A lower side around an outer circumferential arc-shaped portion of the lower surface of the ingot is open so that liquid that serves as a medium of the ultrasonic wave does not collect around the outer circumferential arc-shaped portion of the lower surface of the ingot. As a result, a peel-off layer formed in the ingot is not immersed in liquid when an ultrasonic wave is applied to the upper surface of the ingot via the liquid layer. Consequently, even when the ingot becomes thin, the ingot can be separated at the peel-off layer, and a wafer can be peeled off from the ingot.

First claim

What is claimed is:

1. A peeling method for separating a cylindrical ingot that has a peel-off layer formed therein at the peel-off layer and peeling off a disk-shaped wafer from the ingot, the peeling method comprising:
an ultrasonic wave applying step of applying an ultrasonic wave to an upper surface of the ingot via a liquid layer supplied to the upper surface of the ingot from an ultrasonic wave applying unit, in a state in which an outer circumferential region of a lower surface of the ingot is sucked on a holding surface of a chuck table and a lower side around an outer circumferential arc-shaped portion of the lower surface of the ingot has a radius approximately equal to an outer radius of the holding surface, wherein the liquid layer is supplied to the upper surface of the ingot from an opening of an ultrasonic nozzle of the ultrasonic wave applying unit.

2. The peeling method according to claim 1 , wherein the ultrasonic wave applying step includes applying a second ultrasonic wave by a second ultrasonic wave applying unit to the upper surface of the ingot via a second liquid layer.

3. The peeling method according to claim 2 , wherein the ultrasonic wave applying unit and the second ultrasonic wave applying unit are vibrated under the same conditions.

4. A peeling apparatus for separating a cylindrical ingot that has a peel-off layer formed therein at the peel-off layer and peeling off a disk-shaped wafer from the ingot, the peeling apparatus comprising:
an ultrasonic wave applying unit that applies an ultrasonic wave to an upper surface of the ingot via a liquid layer, wherein:
the ultrasonic wave applying unit includes a first ultrasonic wave applying unit that applies an ultrasonic wave to a first region in the upper surface of the ingot at a first energy density, and
the liquid layer is supplied to the upper surface of the ingot from an opening of an ultrasonic nozzle of the first ultrasonic wave applying unit; and
a chuck table that has a circular holding surface for holding under suction an outer circumferential region of a lower surface of the ingot, wherein:
the holding surface includes:
a flat circular central region,
an annular suction region that surrounds the central region and communicates with a suction source via a suction channel,
an outer annular groove within the annular suction region which communicates with the suction source via the suction channel, and
a flat annular outermost region that surrounds the outer annular groove and is positioned on an outermost side of the holding surface, wherein the flat annular outermost region is defined between the outer annular groove and the outermost side of the holding surface, and

a width of a portion of the outermost region along a radial direction of the holding surface is equal to or less than 5% of a radius of the holding surface, the portion of the outermost region surrounding an outer circumferential arc-shaped portion of the suction region.

5. The peeling apparatus according to claim 4 , wherein an upper portion of the chuck table including the holding surface is composed of stainless steel.

6. The peeling apparatus according to claim 5 , wherein:
the ultrasonic wave applying unit further includes:
a second ultrasonic wave applying unit that applies an ultrasonic wave to a second region wider than the first region in the upper surface of the ingot at a second energy density lower than the first energy density.

7. The peeling apparatus according to claim 4 , wherein:
the ultrasonic wave applying unit further includes:
a second ultrasonic wave applying unit that applies an ultrasonic wave to a second region wider than the first region in the upper surface of the ingot at a second energy density lower than the first energy density.

8. The peeling apparatus according to claim 4 , wherein
the annular suction region includes an inner annular groove which is proximate to the flat circular central region and communicates with the suction source via the suction channel.

9. The peeling apparatus according to claim 8 , wherein
the annular suction region includes a flat annular intermediate region between the inner annular grove and the outer annular groove.

Assignees

• Disco Corp

Inventors

• Yamamoto Ryohei
• Honoki Koyo
• Itabashi Koji

Classifications

• B28D5/0052

  Means for supporting or holding work during breaking (means for conveying work to or discharging work from the breaking machine B28D5/0058) · CPC title

• B23K26/53 Primary

  for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks · CPC title

• B23K2103/50

  Inorganic materials other than metals or composite materials · CPC title

• B28D5/0094

  the supporting or holding device being of the vacuum type · CPC title

• B28D5/047 Primary

  by ultrasonic cutting (using abrading substances or abrading tools subjected to a bouncing action by ultrasonic energy B24B1/04) · CPC title