Method for producing wafers using ultrasound

Patent metadata

Field	Value
Publication number	US-11446771-B2
Application number	US-201916685393-A
Country	US
Kind code	B2
Filing date	Nov 15, 2019
Priority date	Nov 21, 2018
Publication date	Sep 20, 2022
Grant date	Sep 20, 2022

Abstract

A wafer producing method for producing a wafer from an ingot, the ingot being previously formed with a separation layer along which the wafer is to be separated from the ingot. The wafer producing method includes a first ultrasonic vibration applying step of applying ultrasonic vibration to a given area of the ingot at a high density to thereby form a partially broken portion where a part of the separation layer is broken, a second ultrasonic vibration applying step of applying the ultrasonic vibration to the whole area of the ingot larger than the given area at a low density, after performing the first ultrasonic vibration applying step, thereby forming a fully broken portion where the separation layer is fully broken in such a manner that breaking starts from the partially broken portion, and a separating step of separating the wafer from the ingot along the fully broken portion.

First claim

What is claimed is:

1. A wafer producing method for producing a wafer from an ingot after forming a separation layer inside the ingot by setting a focal point of a laser beam having a transmission wavelength to the ingot inside the ingot at a predetermined depth from one end surface of the ingot, the predetermined depth corresponding to a thickness of the wafer to be produced, and next applying the laser beam to the ingot, the wafer producing method comprising:
a first ultrasonic vibration applying step of applying ultrasonic vibration to a given area of the ingot at a first density to thereby form a partially broken portion where a part of the separation layer is broken;
a second ultrasonic vibration applying step of applying the ultrasonic vibration to a whole area of the ingot larger than the given area at a second density lower than the first density, after performing the first ultrasonic vibration applying step, thereby forming a fully broken portion where the separation layer is fully broken in such a manner that breaking starts from the partially broken portion; and
a separating step of separating the wafer from the ingot along the fully broken portion.

2. The wafer producing method according to claim 1 , wherein
the ultrasonic vibration is applied through a layer of water to the ingot in the first ultrasonic vibration applying step and the second ultrasonic vibration applying step.

3. The wafer producing method according to claim 1 , wherein
the ingot includes a hexagonal single-crystal SiC ingot having a c-axis and a c-plane perpendicular to the c-axis, and
the separation layer is composed of a modified portion and cracks extending isotropically from the modified portion along the c-plane, the modified portion being formed by setting a focal point of a laser beam having a transmission wavelength to hexagonal single-crystal SiC inside the SiC ingot at a predetermined depth from the one end surface of the SiC ingot, the predetermined depth corresponding to the thickness of the wafer to be produced, and next applying the laser beam to the SiC ingot to thereby decompose SiC into Si and C.

4. The wafer producing method according to claim 3 , wherein
the c-axis is inclined at an off angle with respect to a normal to the one end surface of the SiC ingot, the off angle being formed between the c-plane and the one end surface,
the focal point of the laser beam is moved in a direction perpendicular to a direction of formation of the off angle to thereby continuously form the modified portion in the direction perpendicular to the direction of formation of the off angle, and
the focal point of the laser beam is indexed in the direction of formation of the off angle in a range not greater than a range of formation of the cracks,
wherein a plurality of linear modified portions are arranged side by side in the direction of formation of the off angle in such a manner that the cracks extending from any adjacent ones of the plurality of linear modified portions are overlapped.

Assignees

• Disco Corp

Inventors

• Yamamoto Ryohei

Classifications

• H10P54/00 Primary

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• B23K26/53 Primary

  for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks · CPC title

• B23K26/0006

  taking account of the properties of the material involved (B23K26/32, B23K26/40 take precedence) · CPC title

• B23K26/38

  by boring or cutting · CPC title

• B23K26/0093

  combined with mechanical machining or metal-working covered by other subclasses than B23K · CPC title