Method and apparatus for polishing a substrate

Patent metadata

Field	Value
Publication number	US-2018222007-A1
Application number	US-201815946843-A
Country	US
Kind code	A1
Filing date	Apr 6, 2018
Priority date	Jul 19, 2011
Publication date	Aug 9, 2018
Grant date	—

Abstract

A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus is configured to control a temperature of the polishing surface of the polishing pad by blowing a gas on the polishing pad during polishing. The polishing apparatus includes a pad temperature control mechanism having at least one gas ejection nozzle for ejecting a gas toward the polishing pad and configured to blow the gas onto the polishing pad to control a temperature of the polishing pad, and an atomizer having at least one nozzle for ejecting a liquid or a mixed fluid of a gas and a liquid and configured to blow the liquid or the mixed fluid onto the polishing pad to remove foreign matters on the polishing pad. The pad temperature control mechanism and the atomizer are formed into an integral unit.

First claim

1 - 44 . (canceled)

45 . A polishing method of polishing a surface of a substrate as an object to be polished by pressing the substrate against a polishing pad on a polishing table, the polishing method comprising:
controlling a temperature of the polishing pad by ejecting a gas toward the polishing pad, said controlling the temperature of the polishing pad being started after setting a preset temperature as a control target temperature of the polishing pad; monitoring the temperature of the polishing pad; and judging that polishing abnormality occurs in the case where the time when the temperature of the polishing pad becomes outside the range of said preset temperature exceeds a predetermined time continuously after the temperature of the polishing pad reaches the range of said preset temperature.

46 . The polishing method according to claim 45 , wherein said becoming outside the range of said preset temperature comprises becoming outside the range of an upper limit or a lower limit of said preset temperature.

47 . The polishing method according to claim 45 , wherein when it is judged that said polishing abnormality occurs, an interlock works so that polishing of a subsequent substrate is not performed.

48 . A polishing method of polishing a surface of a substrate as an object to be polished by pressing the substrate against a polishing pad on a polishing table, the polishing method comprising:
controlling a temperature of the polishing pad by ejecting a gas toward the polishing pad; monitoring the temperature of the polishing pad; and judging that polishing abnormality occurs in the case where the temperature of the polishing pad does not reach a target temperature after the elapse of a predetermined time from starting said controlling the temperature of the polishing pad.

49 . The polishing method according to claim 48 , wherein said controlling the temperature of the polishing pad is performed by adjusting a flow rate of the gas ejected toward the polishing pad with a PID control so that the temperature of the polishing pad becomes within the range of an upper limit and a lower limit centering on a preset temperature.

50 . The polishing method according to claim 48 , wherein said controlling the temperature of the polishing pad is performed so that the temperature of the polishing pad becomes within the range of an upper limit and a lower limit centering on a preset temperature;
said monitoring the temperature of the polishing pad is performed such that the temperature of the polishing pad is compared with the lower limit at the time when a preset time as an estimated time from starting said controlling the temperature of the polishing pad to reaching the lower limit has elapsed; and it is judged that said polishing abnormality occurs in the case where the temperature of the polishing pad does not reach the lower limit.

51 . The polishing method according to claim 48 , wherein said controlling the temperature of the polishing pad is performed so that the temperature of the polishing pad becomes within the range of an upper limit and a lower limit centering on a preset temperature;
said monitoring the temperature of the polishing pad is performed such that a required time from starting said controlling the temperature of the polishing pad to reaching the lower limit is measured, and the required time is compared with a preset time as an estimated time from starting said controlling the temperature of the polishing pad to reaching the lower limit; and it is judged that said polishing abnormality occurs in the case where the required time is longer than the preset time.

52 . A polishing method of polishing a surface of a substrate as an object to be polished by pressing the substrate against a polishing pad on a polishing table, the polishing method comprising:
controlling a temperature of the polishing pad by ejecting a gas toward the polishing pad, said controlling the temperature of the polishing pad being started after setting a preset temperature as a control target temperature of the polishing pad; monitoring the temperature of the polishing pad; changing said preset temperature of the polishing pad during polishing; and judging that polishing abnormality occurs in the case where the temperature of the polishing pad does not reach the changed preset temperature after the elapse of a predetermined time from changing said preset temperature.

53 . The polishing method according to claim 52 , wherein said controlling the temperature of the polishing pad is performed so that the temperature of the polishing pad becomes within the range of an upper limit and a lower limit centering on a preset temperature;
said monitoring the temperature of the polishing pad is performed such that the temperature of the polishing pad is compared with the lower limit at the time when a preset time as an estimated time from starting said controlling the temperature of the polishing pad to reaching the lower limit has elapsed; and it is judged that said polishing abnormality occurs in the case where the temperature of the polishing pad does not reach the lower limit.

54 . The polishing method according to claim 52 , wherein said controlling the temperature of the polishing pad is performed so that the temperature of the polishing pad becomes within the range of an upper limit and a lower limit centering on a preset temperature;
said monitoring the temperature of the polishing pad is performed such that a required time from starting said controlling the temperature of the polishing pad to reaching the lower limit is measured, and the required time is compared with a preset time as an estimated time from starting said controlling the temperature of the polishing pad to reaching the lower limit; and it is judged that said polishing abnormality occurs in the case where the required time is longer than the preset time.

55 . The polishing method according to claim 52 , wherein when it is judged that said polishing abnormality occurs, an interlock works so that polishing of a subsequent substrate is not performed.

Assignees

• Ebara Corp

Inventors

• Motoshima Yasuyuki
• Maruyama Toru
• Matsuo Hisanori

Classifications

• B24B53/017

  Devices or means for dressing, cleaning or otherwise conditioning lapping tools · CPC title

• B24B49/14

  taking regard of the temperature during grinding · CPC title

• B24B37/34

  Accessories · CPC title

• B24B55/02

  Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant (cooling or lubricating during dressing operation B24B53/095; incorporated in grinding wheels B24D) · CPC title

• B24B37/015 Primary

  Temperature control · CPC title