Chemical mechanical polishing method

Patent metadata

Field	Value
Publication number	US-10160090-B2
Application number	US-201514939228-A
Country	US
Kind code	B2
Filing date	Nov 12, 2015
Priority date	Nov 12, 2015
Publication date	Dec 25, 2018
Grant date	Dec 25, 2018

Abstract

A chemical mechanical polishing (CMP) apparatus includes a processing chamber, a platen, a wafer heater and a carrier head. The platen is disposed in the processing chamber and is configured to allow a polishing pad to be disposed thereon. The wafer heater is disposed in the processing chamber and is configured to heat a wafer. The carrier head is disposed in the processing chamber and is configured to hold the heated wafer against the polishing pad.

First claim

What is claimed is:

1. A chemical mechanical polishing (CMP) method, comprising:
decreasing a first temperature difference between a wafer and a polishing pad by disposing the wafer on a wafer hot plate spaced from the polishing pad and by increasing a temperature of the wafer hot plate with a controller to heat the wafer;
separating the wafer from the wafer hot plate;
holding the wafer against the polishing pad; and
rotating at least one of the wafer and the polishing pad.

2. The CMP method of claim 1 , wherein the separating comprises picking up the wafer from the wafer hot plate and wherein the holding comprises
moving the wafer to be against the polishing pad.

3. The CMP method of claim 1 , further comprising:
decreasing a second temperature difference between an environment where the wafer is and the polishing pad.

4. The CMP method of claim 1 , further comprising:
increasing a temperature of the polishing pad before the rotating.

5. The CMP method of claim 1 , further comprising:
increasing a temperature of slurry; and
supplying the slurry with the increased temperature onto the polishing pad.

6. The CMP method of claim 5 , wherein the temperature of the slurry is increased to a temperature lower than an activation temperature of the slurry.

7. The CMP method of claim 1 , further comprising heating a slurry supplier having an end portion adjacent a chamber with a slurry heater in contact with the end portion of the slurry supplier.

8. The CMP method of claim 1 , further comprising moving the wafer sideward from the wafer hot plate to the polishing pad.

9. A chemical mechanical polishing (CMP) method, comprising:
decreasing a temperature difference between a wafer and a polishing pad by heating the polishing pad with a pad heater in contact with the polishing pad and by disposing the wafer on a wafer hot plate different from the pad heater and by increasing a temperature of the wafer hot plate with a controller to heat the wafer; and
polishing the wafer against the polishing pad.

10. The CMP method of claim 9 , further comprising heating a chamber with a chamber heater different from the wafer hot plate and the pad heater and in contact with the chamber.

11. The CMP method of claim 9 , further comprising detecting a temperature of the wafer hot plate with a first thermal sensor and a temperature of the pad heater with a second thermal sensor different from the first thermal sensor.

12. The CMP method of claim 11 , further comprising detecting a temperature of a chamber heater with a third thermal sensor different from the first and second thermal sensors.

13. The CMP method of claim 9 , further comprising heating a slurry supplier having an end portion adjacent a chamber with a slurry heater in contact with the end portion of the slurry supplier.

14. The CMP method of claim 9 , further comprising moving the wafer sideward from the wafer hot plate to the polishing pad.

15. A chemical mechanical polishing (CMP) method, comprising:
decreasing a temperature difference between a wafer and a polishing pad by controlling a temperature of a wafer hot plate configured to heat the wafer with a first controller and a temperature of a pad heater configured to heat the polishing pad with a second controller different from the first controller; and
polishing the wafer against the polishing pad.

16. The CMP method of claim 15 , further comprising controlling a temperature of a chamber with a third controller different from the first and second controllers.

17. The CMP method of claim 15 , further comprising detecting a temperature of the wafer hot plate with a first thermal sensor and a temperature of the pad heater with a second thermal sensor different from the first thermal sensor.

18. The CMP method of claim 17 , further comprising detecting a temperature of a chamber heater with a third thermal sensor different from the first and second thermal sensors.

19. The CMP method of claim 15 , further comprising heating a slurry supplier having an end portion adjacent a chamber with a slurry heater in contact with the end portion of the slurry supplier.

20. The CMP method of claim 15 , further comprising moving the wafer sideward from the wafer hot plate to the polishing pad.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Cheng Chih-Lung
• KUO Yu-Ming
• Hsu Li-Ming

Classifications

• B24B37/20 Primary

  Lapping pads for working plane surfaces · CPC title

• B24B37/015 Primary

  Temperature control · CPC title

• B24B55/02

  Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant (cooling or lubricating during dressing operation B24B53/095; incorporated in grinding wheels B24D) · CPC title

• B24B7/228

  for grinding thin, brittle parts, e.g. semiconductors, wafers (grinding edges of thin, brittle parts B24B9/065) · CPC title

• B24B49/14

  taking regard of the temperature during grinding · CPC title