Method for manufacturing a heat exchanger having a temperature probe
US-11745280-B2 · Sep 5, 2023 · US
Solder feeding devices; Solder melting pans
Solder feeding devices; Solder melting pans · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K3/06 |
| Official title | Solder feeding devices; Solder melting pans |
| Display label | Solder feeding devices; Solder melting pans |
| Total patents | 76 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 4 |
| 2016 | 6 |
| 2017 | 9 |
| 2018 | 15 |
| 2019 | 4 |
| 2020 | 8 |
| 2021 | 8 |
| 2022 | 3 |
| 2023 | 5 |
| 2024 | 5 |
| 2025 | 8 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Sleeve soldering device and method of producing electronic device
US-11696411-B2 · Jul 4, 2023 · US
Solder cutting device, solder cutting unit, part mounting device, and production system
US-2023017361-A1 · Jan 19, 2023 · US
Method of applying solid brazing material, method of producing coated workpiece, application apparatus, and roll-shaped solid brazing material
US-2022118540-A1 · Apr 21, 2022 · US
Method for discharging fluid
US-11259415-B2 · Feb 22, 2022 · US
Device for manufacturing plate solder and method for manufacturing plate solder
US-11213921-B2 · Jan 4, 2022 · US
Method for manufacturing a heat exchanger comprising a temperature probe
US-2021354223-A1 · Nov 18, 2021 · US
Method for manufacturing a heat exchanger having a temperature probe
US-2021354224-A1 · Nov 18, 2021 · US
Wire automatic soldering system
US-11141807-B2 · Oct 12, 2021 · US
Method for producing turbine blade
US-11020810-B2 · Jun 1, 2021 · US
Method for discharging fluid
US-2021144863-A1 · May 13, 2021 · US
Soldering assembly, method and use
US-2021060676-A1 · Mar 4, 2021 · US
Nozzle, system and method
US-2021060678-A1 · Mar 4, 2021 · US
Fluid discharge device
US-10932372-B2 · Feb 23, 2021 · US
Method for connecting at least two components of an endoscope, component of an endoscope and endoscope
US-10842353-B2 · Nov 24, 2020 · US
Sleeve soldering device and method of producing electronic device
US-2020367366-A1 · Nov 19, 2020 · US
Viscous fluid supply device
US-10722964-B2 · Jul 28, 2020 · US
Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint
US-10675719-B2 · Jun 9, 2020 · US
Heat exchanger, air-conditioning apparatus including the same, and method of producing flat-tube U-bend
US-10677531-B2 · Jun 9, 2020 · US
Fluid discharge device, fluid discharge method, and fluid application device
US-10632492-B2 · Apr 28, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K3/06?
- CPC B23K3/06 is the Cooperative Patent Classification code for “Solder feeding devices; Solder melting pans.”
- How many patents are filed under CPC B23K3/06 (Solder feeding devices; Solder melting pans)?
- Our database includes 76 publications tagged with this CPC code.
- Is patent activity under CPC B23K3/06 growing?
- Publication counts under this code: 5 in 2024 vs 8 in 2025 (latest complete years).