Fluid discharge device, fluid discharge method, and fluid application device

Patent metadata

Field	Value
Publication number	US-10632492-B2
Application number	US-201615543155-A
Country	US
Kind code	B2
Filing date	Jan 13, 2016
Priority date	Jan 13, 2015
Publication date	Apr 28, 2020
Grant date	Apr 28, 2020

Abstract

A defect may occur in which as the amount of fluid discharged by a fluid discharge device decreases, a mask is not filled with the fluid even when the fluid is discharged. In order to fill a workpiece with the fluid, it is necessary to replace air in the workpiece corresponding to a discharge part with the fluid. The air in the workpiece is removed in advance, thereby filling the workpiece with the discharged fluid. A fluid discharge device in which, at one end of a discharge head, a suction port for sucking air in the mask on the workpiece, and a fluid discharge device having a discharge nozzle formed thereon for discharging the fluid are formed is used.

First claim

The invention claimed is:

1. A fluid application device for forming a coated portion on a workpiece of an electronic component, the fluid application device comprising:
a discharge head including a tank capable of accommodating a molten solder, and a nozzle formed at one end of the discharge head, the discharge head being configured to be positioned above the workpiece, the discharge head being configured in such a manner that the discharge head moves closer to the workpiece until the nozzle contacts the workpiece during preparation for formation of the coated portion; the discharge head moves horizontally with respect to the workpiece while ejecting the molten solder in the tank from the nozzle in a state where the nozzle is in contact with the workpiece during formation of the coated portion; and the discharge head moves away from the workpiece after the formation of the coated portion is completed and the ejection of the molten solder from the nozzle is stopped;
a heater for keeping the molten solder in the tank at a desired temperature;
first pressure supply means for supplying a first pressure into the tank and ejecting the molten solder in the tank onto the workpiece from an opening of the nozzle;
second pressure supply means for supplying a second pressure into the tank and holding the molten solder in the tank without ejecting the molten solder from the opening of the nozzle;
a pressure sensor for monitoring the pressure in the tank;
a controller configured to control a pressure to be supplied into the tank based on a signal from the pressure sensor; and
a solder supply configured to supply an additional solder into the tank so that the amount of the molten solder in the tank is kept constant when the molten solder in the tank is consumed during operation,
wherein the solder supply is apart from the tank, and
wherein both the first pressure supply means and the second pressure supply means are connected to the tank via a single common pipeline, and
wherein a single valve controls fluid communiction through the single common pipeline that is shared by both the first and second pressure supply means, and the single valve is configured to switch between: (1) a state allowing fluid communication through the single common pipeline between only the first pressure supply means and the tank to provide the tank with the first pressure through the single common pipeline, and (2) a state allowing fluid communication through the single common pipeline between only the second pressure supply means and the tank to provide the tank with the second pressure through the single common pipeline.

2. The fluid application device according to claim 1 , wherein
the discharge head is configured to position the nozzle above the workpiece,
the first pressure is a positive pressure,
the second pressure is a negative pressure,
the first pressure supply means includes a positive pressure supply source, and
the second pressure supply means includes a negative pressure supply source.

3. The fluid application device according to claim 2 , wherein the controller is configured to input data related to an amount of the fluid in the tank.

4. The fluid application device according to claim 1 , wherein
the discharge head is configured to position the nozzle below the workpiece,
the first pressure is a positive pressure,
the second pressure is an atmospheric pressure or a positive pressure, and
the first pressure supply means and the second pressure supply means include a common positive pressure supply source.

5. The fluid application device according to claim 4 , wherein the controller is configured to input data related to an amount of fluid in the tank.

6. The fluid application device according to claim 5 , further comprising a solder supply for supplying an additional solder into the tank when the fluid application device is in operation.

7. The fluid application device according to claim 1 , wherein the controller is configured to detect a position of the discharge head and control the first pressure supply means to supply the first pressure into the tank of the discharge head when the discharge head descends toward the workpiece and reaches a prescribed position.

Assignees

• Senju Metal Industry Co

Inventors

• Nauchi Takashi
• Nakamura Hideki
• Mutsuji Toshihiko
• Kitazawa Kazuya

Classifications

• H05K2203/128

  Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder · CPC title

• B23K3/06

  Solder feeding devices; Solder melting pans · CPC title

• B05C9/10 Primary

  the auxiliary operation being performed before the application (B05C9/14 takes precedence) · CPC title

• H05K3/4007

  Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465) · CPC title

• B05C5/0254

  Coating heads with slot-shaped outlet (B05C5/0283 takes precedence) · CPC title