Method for connecting at least two components of an endoscope, component of an endoscope and endoscope

US10842353B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10842353-B2
Application numberUS-201815991282-A
CountryUS
Kind codeB2
Filing dateMay 29, 2018
Priority dateApr 1, 2015
Publication dateNov 24, 2020
Grant dateNov 24, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In the case of a method according to the invention for connecting at least two components of an endoscope, at least one brazing preform, which contains a high-temperature brazing solder, is introduced into at least one brazing solder reservoir of at least one of the components, the at least two components are held in relation to one another in such a way that at least one brazing gap that is in capillary connection with the at least one brazing solder reservoir is formed between joining regions of the at least two components that are assigned to one another, and the arrangement comprising the at least two components and the at least one brazing preform is heated to a brazing temperature of the high-temperature brazing solder. The invention also relates to a component of an endoscope and to an endoscope.

First claim

Opening claim text (preview).

What is claimed is: 1. An endoscope comprising: at least two components connected together by a brazing solder provided in at least one brazing gap between joining regions of the at least two components, wherein one of the at least two components has at least one brazing solder reservoir that is in capillary connection with the at least one brazing gap, and wherein the at least one brazing solder reservoir and the at least one brazing gap being formed such that a volume of the at least one brazing solder reservoir is greater than a volume of the at least one brazing gap by at least an amount that corresponds to a proportion of a binder in the brazing solder, wherein one of the at least two components is an endoscope head having a cylindrical bore, wherein another one of the at least two components is an inner bush that is received within the cylindrical bore of the endoscope head, wherein the inner bush is formed of a shank having a bore extending therethrough, wherein, at each end of the shank, a disk extends around an outer periphery of the shank, and wherein, at a central area of the shank, a cylinder extends around an outer periphery of the shank. 2. The endoscope according to claim 1 , wherein the at least one brazing solder reservoir is provided as an annular groove in at least one of the disks. 3. The endoscope according to claim 1 , wherein the cylinder has a bore extending therethrough in a direction transverse to the bore of the shank. 4. The endoscope according to claim 3 , wherein the bore of the cylinder opens into the bore of the shank.

Assignees

Inventors

Classifications

  • A61B1/0011Primary

    Manufacturing of endoscope parts · CPC title

  • Ni as the principal constituent · CPC title

  • specially adapted for particular articles or work · CPC title

  • Powders, particles or spheres; Preforms made therefrom · CPC title

  • circumferential seams, e.g. of shells · CPC title

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What does patent US10842353B2 cover?
In the case of a method according to the invention for connecting at least two components of an endoscope, at least one brazing preform, which contains a high-temperature brazing solder, is introduced into at least one brazing solder reservoir of at least one of the components, the at least two components are held in relation to one another in such a way that at least one brazing gap that is in…
Who is the assignee on this patent?
Storz Karl Se & Co Kg
What technology area does this patent fall under?
Primary CPC classification A61B1/0011. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Nov 24 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).