Method for discharging fluid

Patent metadata

Field	Value
Publication number	US-11259415-B2
Application number	US-202117153978-A
Country	US
Kind code	B2
Filing date	Jan 21, 2021
Priority date	Dec 15, 2015
Publication date	Feb 22, 2022
Grant date	Feb 22, 2022

Abstract

In conventional fluid discharge devices, a discharge head used should be increased in size according to increase in size of a workpiece such as silicon wafer. However, if the discharge head increases in length, a deformation amount of a mask used for discharging the fluid on the workpiece increases, thereby the discharging amount varies. Discharging the fluid in a reciprocating manner is performed using a fluid discharging device including a head unit having a width shorter than a length of the workpiece. A suction port having opening portions each having a slit shape are disposed on the both sides of the discharge nozzle in a vicinity of the discharge nozzle.

First claim

What is claimed is:

1. A method for discharging molten solder for applying the molten solder into a mask on a circular workpiece of electronic component, the method comprising
using a fluid discharge device including a head unit, the head unit including a tank storing the molten solder and provided with a first heater, and a discharge head, to discharge the molten solder from a discharge nozzle by reciprocating the discharge head with respect to the workpiece, after sucking a substance in the mask from a suction port, wherein
the head unit has a longitudinal width shorter than a diameter of the workpiece,
the discharge head has the suction port used for the sucking the substance in the mask on the workpiece is formed on a forward side of a traveling direction of the discharge head, and the discharge nozzle used to discharge the molten solder is formed on a backward side of the traveling direction, and
a second heater is provided at a lower end of the discharge nozzle,
wherein the substance in the mask includes solder that has been previously discharged, and the second heater heating the previously discharged solder, which is present outside the discharge head in the mask, as the molten solder included in the substance in the mask that is sucked through the suction port.

2. The method for discharging the molten solder according to claim 1 , wherein the discharge head has slit openings as the discharge nozzle and the suction port.

3. The method for discharging the molten solder according to claim 1 , wherein the suction port is disposed on both sides of the discharge nozzle in the discharge head.

Assignees

• Senju Metal Industry Co

Inventors

• Nakamura Hideki
• Nauchi Takashi
• Mutsuji Toshihiko
• Suzuki Ryoichi

Classifications

• H10W72/0112

  Apparatus for manufacturing bump connectors · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/01223

  in liquid form, e.g. by dispensing droplets or by screen printing · CPC title

• B23K1/206

  Cleaning · CPC title

• B05D1/26 Primary

  performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface · CPC title