Sleeve soldering device and method of producing electronic device

Patent metadata

Field	Value
Publication number	US-2020367366-A1
Application number	US-202016874711-A
Country	US
Kind code	A1
Filing date	May 15, 2020
Priority date	May 16, 2019
Publication date	Nov 19, 2020
Grant date	—

Abstract

A sleeve soldering device has a displacement sensor and a heat flux sensor. The displacement sensor detects a physical quantity related to a pressure from a heated sleeve heated by a heater onto an electric board when the heated sleeve presses the electric board. The displacement sensor detects a physical quantity related to a deformation amount of the electric board due to thermal energy from the heater. The heat flux sensor detects a physical quantity related to a heat transfer amount from the heater to the electric board when the heated sleeve is pressed to the electric board. A control part compares each of detection values obtained from the displacement sensor and the heat flux sensor with a respective judgment reference so as to detect whether each detection value satisfies the respective reference.

First claim

What is claimed is:

1 . A sleeve soldering device performing a soldering process of a terminal of an electronic component and a terminal of an electric board, comprising:
a sleeve having a through hole through which a solder is passed, the sleeve providing thermal energy when being in contact with the electric board, and feeding the solder to a soldering part at which the terminal of the electronic component and the terminal of the electric board are soldered together; a heater generating thermal energy and heating the sleeve by the generated thermal energy; a movement mechanism moving the sleeve heated by the thermal energy generated by the heater when the sleeve is in contact with and pressed to the electric board; a detection part detecting at least one of a physical quantity related to a pressure from the sleeve to the electric board when the sleeve presses the electric board, a physical quantity related to a heat transfer amount of thermal energy generated by the heater supplied to the electric board when the sleeve presses the electric board, and a physical quantity related to a deformation amount of the electric board due to the thermal energy generated by the heater; and a judgment part comparing a detection value of the physical quantity detected by the detection part with a predetermined judgment reference, and detecting whether the detection value satisfies the predetermined judgment reference on the basis of the comparison result.

2 . The sleeve soldering device according to claim 1 , wherein
the detection part detects the physical quantity related to the pressure from the sleeve to the electric board and the physical quantity related to the heat transfer amount of thermal energy generated by the heater supplied to the electric board.

3 . The sleeve soldering device according to claim 1 , further comprising a spring supporting an assembly structure comprising the sleeve, wherein
the movement mechanism presses the sleeve onto the electric board while the spring supports the assembly structure, and the detection part detects a change amount in length of the spring so as to obtain the physical quantity related to the pressure from the sleeve to the electric board.

4 . The sleeve soldering device according to claim 1 , wherein
the detection part detects a heat flux amount of thermal energy generated by the heater supplied from the sleeve to the electric board.

5 . The sleeve soldering device according to claim 1 , wherein
the detection part detects a displacement amount of the sleeve in an axial direction of the sleeve as the physical quantity related to the deformation amount of the electric board due to the thermal energy generated by the heater.

6 . The sleeve soldering device according to claim 1 , wherein
the detection part repeatedly detects the physical quantity related to the pressure from the sleeve to the electric board, the judgment part repeatedly detects whether a detection value as the physical quantity detected by the detection part satisfies the predetermined judgment reference, and the sleeve soldering device further comprises a control part, wherein when a detection result of the judgment part indicates that the detection value does not satisfy the predetermined judgment reference, the control part instructs the movement mechanism so as to adjust a pressure from the sleeve to the electric board so that a following to detection value detected by the detection part satisfies the predetermined judgment reference.

7 . The sleeve soldering device according to claim 1 , wherein
the detection part repeatedly detects the physical quantity related to the heat transfer amount of thermal energy generated by the heater supplied to the electric board, the judgment part repeatedly detects whether a detection value as the physical quantity detected by the detection part satisfies the predetermined judgment reference, and the sleeve soldering device further comprises a control part, wherein when a detection result of the judgment part indicates that the detection value does not satisfy the predetermined judgment reference, the control part instructs the heater so as to adjust a pressure from the sleeve to the electric board so that a following detection value detected by the detection part satisfies the predetermined judgment reference.

8 . A computer implemented method of manufacturing an electronic device composed of an electronic component and an electric board, the method performing a soldering process between a terminal of the electronic component and a terminal of the electric board sleeve by using a sleeve soldering device comprising a sleeve in which a through hole is formed, a movement mechanism and a heater heating the sleeve, wherein a solder is fed into the through hole of the sleeve, the movement mechanism moves the sleeve,
the computer implemented method performing: a movement step which moves the sleeve by the movement mechanism to the electric board so as to press the sleeve heated by thermal energy generated by the heater to the electric board; a solder feeding step which feeds a solder to a soldering part between the terminal of the electronic component and the terminal of the electric board through the through hole formed in the sleeve while the sleeve is pressed to the electric board; a detection step which obtains a detection value detected by a detection part related to at least one of:
a physical quantity related to a pressure from the sleeve to the electric board when the sleeve heated by thermal energy generated by the heater is pressed to the electric board,
a physical quantity related to a heat flux amount supplied from the heater to the electric board through the sleeve when the sleeve heated by thermal energy generated by the heater is pressed to the electric board, and
a physical quantity related to a deformation amount of the electric board due to the thermal energy generated by the heater; and
performing a judgment step for comparing the detection value with a predetermined reference and judging whether the detection value satisfies the predetermined reference on the basis of a comparison result.

9 . The computer implemented method according to claim 8 , wherein
in the detection step, the detection part detects the physical quantity related to the pressure from the sleeve to the electric board and the physical quantity related to the heat transfer amount of thermal energy generated by the heater supplied to the electric board.

10 . The computer implemented method according to claim 8 , wherein
the sleeve soldering device used in the method comprises a spring for supporting an assembly structure comprising the sleeve, and in the movement step, the movement mechanism presses the sleeve onto the electric board while the spring supports the assembly structure, and in the detection step, the detection part detects a change amount in length of the spring so as to obtain the physical quantity related to the pressure from the sleeve to the electric board.

11 . The computer implemented method according to claim 8 , wherein
in the detection step, the detection part detects a heat flux amount of thermal energy generated by the heater supplied from the sleeve to the electric board.

12 . The computer implemented method according to claim wherein
in the detection step, the detection part detects a displacement amount of the sleeve in an axial direction of the sleeve as the physical quantity related to the deformation amount of the electric board due to the thermal energy generated by the heater.

13 . The computer implemented method according to claim 8 , wherei

Assignees

• Denso Corp

Inventors

• Kiuchi Hayato
• Furumoto Atsushi
• Hamamoto Kazuyuki
• Iwase Teruhiko
• Fujihira Masayuki

Classifications

• B23K37/053 Primary

  aligning cylindrical work; Clamping devices therefor · CPC title

• B23K37/00

  Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass · CPC title

• B23K2101/04

  Tubular or hollow articles · CPC title

• B23K31/125 Primary

  Weld quality monitoring · CPC title

• H05K3/3447

  Lead-in-hole components · CPC title