Soldering apparatus
US-12434316-B2 · Oct 7, 2025 · US
Solder or residue removing devices
Solder or residue removing devices · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K3/029 |
| Official title | {Solder or residue removing devices} |
| Display label | Solder or residue removing devices |
| Total patents | 25 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2016 | 4 |
| 2017 | 5 |
| 2018 | 4 |
| 2019 | 4 |
| 2020 | 2 |
| 2021 | 2 |
| 2023 | 2 |
| 2025 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Jet soldering apparatus
US-2025162053-A1 · May 22, 2025 · US
Solder removal from semiconductor devices
US-11745281-B2 · Sep 5, 2023 · US
Cleaning pad assembly
US-11602799-B2 · Mar 14, 2023 · US
Solder removal from semiconductor devices
US-2021252621-A1 · Aug 19, 2021 · US
Solder removal from semiconductor devices
US-11020811-B2 · Jun 1, 2021 · US
Cleaning Pad Assembly
US-2020198039-A1 · Jun 25, 2020 · US
Electric iron and soldering device
US-10646944-B2 · May 12, 2020 · US
Solder removal from semiconductor devices
US-2019247943-A1 · Aug 15, 2019 · US
Solder removal from semiconductor devices
US-10307850-B2 · Jun 4, 2019 · US
Rework process and tool design for semiconductor package
US-10269762-B2 · Apr 23, 2019 · US
Solder removal from semiconductor devices
US-2019061034-A1 · Feb 28, 2019 · US
Electric iron and soldering device
US-2018281105-A1 · Oct 4, 2018 · US
Method for semiconductor die removal rework
US-10050012-B2 · Aug 14, 2018 · US
Vacuum Pick-up Confirmation System
US-2018161903-A1 · Jun 14, 2018 · US
Cleaning Pad Assembly
US-2018036819-A1 · Feb 8, 2018 · US
Support Stand for Heating Tools
US-2017165771-A1 · Jun 15, 2017 · US
Method and structure for semiconductor die removal rework
US-2017148762-A1 · May 25, 2017 · US
Apparatus, methods, and systems for removing components from a circuit board
US-2017135257-A1 · May 11, 2017 · US
Rework Process and Tool Design for Semiconductor Package
US-2017125374-A1 · May 4, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K3/029?
- CPC B23K3/029 is the Cooperative Patent Classification code for “Solder or residue removing devices.”
- How many patents are filed under CPC B23K3/029 (Solder or residue removing devices)?
- Our database includes 25 publications tagged with this CPC code.
- Is patent activity under CPC B23K3/029 growing?
- Publication counts under this code: 2 in 2023 vs 2 in 2025 (latest complete years).