Cleaning pad assembly

Patent metadata

Field	Value
Publication number	US-11602799-B2
Application number	US-202016807510-A
Country	US
Kind code	B2
Filing date	Mar 3, 2020
Priority date	Aug 8, 2016
Publication date	Mar 14, 2023
Grant date	Mar 14, 2023

Abstract

The invention details the designs of cleaning pad assemblies for use with heating tools including for example soldering cartridges and soldering irons. The cleaning pads of the assembly are designed to effectively remove and clean the solder from heating tools during and at the end of soldering operations, and allow the collection of the removed solder.

First claim

The invention claimed is:

1. A cleaning pad assembly for use in cleaning bonding material from a solder tool, the cleaning pad assembly comprising:
a solder tool cleaning pad having a base and a plurality of bendable projections extending upward from said base, said bendable projections formed to define an obtuse angle cross-section when viewed parallel to the base and arranged to provide gaps between opposing edges of said bendable projections for removing solder from said solder tool and said obtuse angle shaped projections arranged to have end faces of said opposing edges aligned and spaced in a pattern to form a plurality of open spaces defined by at least four of said bendable projections to accumulate bonding material cleaned from said solder tool in said open spaces.

2. The cleaning pad assembly of claim 1 , wherein said cleaning pad assembly further includes a peripheral wall having a rigidity greater than the rigidity of said bendable projections, and said peripheral wall projecting from a rim of said base.

3. The cleaning pad assembly of claim 2 , wherein said bendable projections have a height greater than a thickness of the bendable projection at a point of contact with said base and said gaps 0.1 mm to 1.5 mm wide between opposing edges of said bendable projections.

4. The cleaning pad assembly of claim 1 , wherein said cleaning pad is formed from high temperature resins, silicon rubber or elastomeric polymer.

5. The cleaning pad assembly of claim 1 , wherein said cleaning pad is reversible and said base of said cleaning pad has an underside having an array of projections in a non-hexagonal pattern different from a hexagonal array pattern of said projections configured in groups of six on an upper-side of said base.

6. The cleaning pad assembly of claim 1 , wherein said projections are configured in groups of six to form a hexagon.

7. A cleaning pad assembly for use in cleaning bonding material from a solder tool, the cleaning pad assembly comprising:
a solder tool cleaning pad having a base and a plurality of bendable projections extending upward from said base, said bendable projections formed to have a “Y” cross-sectional shape cross-section when viewed parallel to the base with gaps between opposing and aligned tip ends of said “Y” shaped projections for removing solder bonding material from said solder tool and said “Y” shaped projections forming a plurality of hexagonal open spaces for accumulating bonding material.

8. The cleaning pad assembly of claim 7 , wherein said cleaning pad assembly further includes a peripheral wall having a rigidity greater than the rigidity of said bendable projections, and said peripheral wall projecting from a rim of said base.

9. The cleaning pad assembly of claim 8 , wherein said bendable projections have a height greater than a thickness of the bendable projection at a point of contact with said base and said gaps 0.1 mm to 1.5 mm wide between opposing and aligned tip ends of said “Y” shaped bendable projections.

10. The cleaning pad assembly of claim 7 , wherein said cleaning pad is formed from high temperature resins, silicon rubber or elastomeric polymer.

11. The cleaning pad assembly of claim 7 , wherein said cleaning pad is reversible and said base of said cleaning pad has an underside having an array of projections in a pattern different from an array pattern of the projections on an upper-side of said base, wherein said array pattern on said upper side comprises projections arranged in groups of six.

12. The cleaning pad assembly of claim 7 , wherein said projections are configured in groups of six to form hexagons within a honeycomb pattern with 0.1 mm to 1.5 mm wide gaps between opposing tip ends of said “Y” shaped projections.

13. A cleaning pad assembly for use in cleaning bonding material from a solder tool, the cleaning pad assembly comprising:
a solder tool cleaning pad having a base and a plurality of bendable projections extending upward from said base, each of said bendable projections formed as angled projections to have obtuse angle cross-section shapes when viewed parallel to the base, clustered to define 0.1 mm to 1.5 mm wide gaps between adjacent aligned edges of said angled projections for removing solder bonding material from said solder tool and an open space encircled by said bendable projections to accumulate solder bonding material in said open spaces, wherein said cleaning pad is reversible and said base of said cleaning pad has an underside having an array of projections in a pattern different from an array pattern of the projections on an upper-side of said base.

Assignees

• Hakko Corp

Inventors

• Miyazaki Mitsuhiko

Classifications

• B23K3/029 Primary

  Solder or residue removing devices · CPC title

• B23K3/04

  Heating appliances · CPC title

• B08B7/00

  Cleaning by methods not provided for in a single other subclass or a single group in this subclass · CPC title

• B23K3/08

  Auxiliary devices therefor · CPC title

• B23K37/00

  Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass · CPC title