Soldering apparatus

Patent metadata

Field	Value
Publication number	US-12434316-B2
Application number	US-202318874560-A
Country	US
Kind code	B2
Filing date	Jun 12, 2023
Priority date	Jun 13, 2022
Publication date	Oct 7, 2025
Grant date	Oct 7, 2025

Abstract

A solder removing mechanism 520 is a solder removing mechanism for removing solder from conveyance claws 510 for conveying a substrate 200 to which the solder is supplied. The solder removing comprise an abutment body 530 that can relatively pass through recesses 511 of the conveyance claws 510 or below the conveyance claws 510.

First claim

The invention claimed is:

1. A soldering apparatus comprising:
a conveyance unit having conveyance claws for gripping and conveying a substrate, the conveyance claws moving along a conveyance rail;
a supply unit for supplying molten solder to the substrate being conveyed by the conveyance claws of the conveyance unit; and
a solder removing mechanism for removing solder from the conveyance claws after conveying the substrate soldered with the molten solder supplied from the supply unit,
wherein the solder removing mechanism comprises an abutment plate that is configured to relatively pass through recesses of the conveyance claws or below the conveyance claws,
wherein the abutment plate comprises a base end part, a distal end part that extends downstream in a direction of movement of the conveyance claws along the conveyance rail, and a bent part between the base end and the distal end part, and
wherein the distal end part is located downstream of the bent part in the direction of movement of the conveyance claws along the conveyance rail and the distal end part extends downstream in the direction of movement of the conveyance claws.

2. The soldering apparatus according to claim 1 , wherein the abutment plate has a first abutment plate that is configured to relatively pass through the recesses of the conveyance claws, and a second abutment plate that is configured to relatively pass under the conveyance claws.

3. The soldering apparatus according to claim 1 comprising a brush positioned on a downstream side of the abutment plate in a conveyance direction of the conveyance claws.

4. The soldering apparatus according to claim 1 comprising a guide part that elongates below the abutment plate and that guides the solder falling from the conveyance claws to a storage tank.

5. The soldering apparatus according to claim 1 comprising a cover that is provided on an upstream side of the abutment plate in a moving direction of the conveyance claws and that extends in a vertical direction.

Assignees

• Senju Metal Industry Co

Inventors

• Kawashima Yasuji
• Taguchi Hiroshi
• Kuramoto Kyoko
• HANZAWA Henri
• Kagaya Tomotake
• Shinohara Katsuhiro

Classifications

• B08B1/12 Primary

  Brushes · CPC title

• B08B1/20

  Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor · CPC title

• H05K3/34

  by soldering · CPC title

• B23K1/085

  Wave soldering · CPC title

• B23K1/018

  Unsoldering; Removal of melted solder or other residues · CPC title