Multiple bonding layers for thin-wafer handling
US-9263314-B2 · Feb 16, 2016 · US
Method for semiconductor die removal rework
US10050012B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10050012-B2 |
| Application number | US-201514951935-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 25, 2015 |
| Priority date | Nov 25, 2015 |
| Publication date | Aug 14, 2018 |
| Grant date | Aug 14, 2018 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
Disclosed are processes and apparatuses for semiconductor die removal and rework, including thin dies. In one aspect the process involves the use of a localized induction heating system to melt targeted solder joints, thereby minimizing the degradation of the thermal performance of the assembly undergoing the rework. Use of a vacuum-based die removal head, optionally in combination with the induction heating system, allows for the removal of thin dies of 150 micrometers thick or less.
First claim
Opening claim text (preview).
What is claimed is: 1. A method, comprising: providing an assembly comprising a substrate and a die attached to the substrate through a solder joint, the die having a thickness of 150 micrometers or less; connecting a die removal head to the die, the die removal head comprising a connecting means to connect the die removal head to the die; heating the solder joint to liquidus using inductive heating; and separating the die from the substrate. 2. The method of claim 1 , wherein the connecting means is a vacuum and the die removal head is a vacuum die removal head fabricated from a thermally stable elastomer. 3. The method of claim 1 , wherein the connecting means is an adhesive located on the surface of the die removal head. 4. The method of claim 1 , wherein the die removal head is attached to a weight to provide gravity-assisted die removal. 5. The method of claim 1 , wherein the die removal head is attached to a spring to provide spring-assisted die removal. 6. The method of claim 2 , wherein the die removal head is attached to a weight to provide gravity-assisted die removal. 7. The method of claim 2 , wherein the die removal head is attached to a spring to provide spring-assisted die removal. 8. The method of claim 1 , wherein the substrate is an organic substrate. 9. A method, comprising: providing an assembly comprising a substrate and a die attached to the substrate through a solder joint, the die having a thickness of 150 micrometers or less; connecting a die removal head to the die, the die removal head comprising a connecting means to connect the die removal head to the die; heating the solder joint to liquidus; and separating the die from the substrate, wherein the die removal head is attached to a spring to provide spring-assisted die removal. 10. The method of claim 9 , wherein the heating is conducted using inductive heating. 11. The method of claim 9 , wherein the connecting means is a vacuum and the die removal head is a vacuum die removal head fabricated from a thermally stable elastomer. 12. The method of claim 9 , wherein the connecting means is an adhesive located on the surface of the die removal head. 13. The method of claim 9 , wherein the substrate is an organic substrate.
Assignees
Inventors
Classifications
Means for aligning · CPC title
Means for applying energy, e.g. ovens or lasers · CPC title
Apparatus therefor · CPC title
- H10W72/071Primary
Connecting or disconnecting · CPC title
Soldering by means of induction heating · CPC title
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Frequently asked questions
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- What does patent US10050012B2 cover?
- Disclosed are processes and apparatuses for semiconductor die removal and rework, including thin dies. In one aspect the process involves the use of a localized induction heating system to melt targeted solder joints, thereby minimizing the degradation of the thermal performance of the assembly undergoing the rework. Use of a vacuum-based die removal head, optionally in combination with the ind…
- Who is the assignee on this patent?
- IBM
- What technology area does this patent fall under?
- Primary CPC classification H10W72/071. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 14 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).