Solder removal from semiconductor devices

Patent metadata

Field	Value
Publication number	US-11745281-B2
Application number	US-202117307253-A
Country	US
Kind code	B2
Filing date	May 4, 2021
Priority date	Aug 24, 2017
Publication date	Sep 5, 2023
Grant date	Sep 5, 2023

Abstract

A solder removal apparatus is provided. The solder removal apparatus comprises a plurality of solder-interfacing protrusions extending from a body by a length. Each of the plurality of solder-interfacing protrusions is configured to remove a corresponding one of a plurality of solder features from a semiconductor device, where each of the plurality of solder features has a height and an amount of solder material.

First claim

What is claimed is:

1. A solder removal apparatus, comprising:
a plurality of solder-interfacing protrusions extending from a body along a first axis, each of the plurality of solder-interfacing protrusions configured to remove a corresponding one of a plurality of solder features from a semiconductor device, each of the plurality of solder features having an amount of solder material,
wherein an outer surface of at least one of the plurality of solder-interfacing protrusions has surface-area increasing features sufficient to support the amount of solder material of the corresponding one of the plurality of solder features,
wherein the surface area-increasing features comprise one or more annular ridges or depressions that increase a surface area of the at least one of the plurality of solder-interfacing protrusions relative to a smooth cylindrical pin displacing a same volume,
wherein cross-sections of the one or more annular ridges or depressions are circular along a plane having a normal vector defined by the first axis.

2. The solder removal apparatus of claim 1 , wherein the plurality of solder-interfacing protrusions is arranged in a first pattern corresponding to a second pattern in which the plurality of solder features of the semiconductor device is arranged.

3. The solder removal apparatus of claim 1 , wherein a length of each solder-interfacing protrusion is greater than a height of the corresponding one of the plurality of solder features.

4. The solder removal apparatus of claim 1 , wherein each solder-interfacing protrusion is removably attached to the body.

5. The solder removal apparatus of claim 1 , wherein the at least one solder-interfacing protrusion comprises a solder-wettable material.

6. The solder removal apparatus of claim 5 , wherein the solder-wettable material comprises copper, tin, gold, silver, nickel, or a combination thereof.

7. The solder removal apparatus of claim 1 , wherein end surfaces of each of the multiple ones of the plurality of solder-interfacing protrusions are coplanar.

8. The solder removal apparatus of claim 1 , wherein a first end surface of a first one of the plurality of solder-interfacing protrusions is vertically offset from a second end surface of a second one of the plurality of solder-interfacing protrusions.

9. The solder removal apparatus of claim 1 , wherein the at least one of the plurality of solder-interfacing protrusions tapers towards an end surface thereof opposite the body.

10. The solder removal apparatus of claim 1 , wherein one or more gaps between adjacent ones of the plurality of solder-interfacing protrusions correspond to one or more features projecting vertically from the semiconductor device.

11. The solder removal apparatus of claim 1 , further comprising a resistive heater operably coupled to the plurality of solder-interfacing protrusions.

12. A solder removal apparatus, comprising:
a body;
a plurality of solder-interfacing protrusions extending from the body along a first axis; and
a resistive heater operably coupled to the plurality of solder-interfacing protrusions,
wherein each of the plurality of solder-interfacing protrusions is configured to mechanically interface with a corresponding one of a plurality of solder features on a semiconductor device, and
wherein an outer surface of at least one of the plurality of solder-interfacing protrusions has a plurality of vertical ridges or depressions such that a surface area of the at least one of the plurality of solder-interfacing protrusions is sufficient to wick away substantially all of the corresponding one of the plurality of solder feature,
wherein the plurality of vertical ridges or depressions extend along second axes parallel with the first axis.

13. The solder removal apparatus of claim 12 , wherein each solder-interfacing protrusion is removably attached to the body.

14. The solder removal apparatus of claim 12 , wherein the at least one solder-interfacing protrusion comprises a solder-wettable material.

15. The solder removal apparatus of claim 14 , wherein the solder-wettable material comprises copper, tin, gold, silver, nickel, or a combination thereof.

16. The solder removal apparatus of claim 12 , wherein the at least one of the plurality of solder-interfacing protrusions tapers towards an end surface thereof opposite the body.

17. The solder removal apparatus of claim 12 , wherein one or more gaps between adjacent ones of the plurality of solder-interfacing protrusions correspond to one or more features projecting vertically from the semiconductor device.

18. A solder removal apparatus, comprising:
a body; and
a plurality of solder-interfacing protrusions extending from the body along a first axis;
wherein each of the plurality of solder-interfacing protrusions is configured to be inserted into a corresponding one of a plurality of solder features on a semiconductor device, and
wherein an outer surface of at least one of the plurality of solder-interfacing protrusions has a plurality of annular ridges or depressions such that a surface area of the at least one of the plurality of solder-interfacing protrusions is sufficient to support substantially all of an amount of solder material of the corresponding one of the plurality of solder features,
wherein cross-sections of the one or more annular ridges or depressions are circular along a plane having a normal vector defined by the first axis.

19. The solder removal apparatus of claim 18 , wherein the at least one solder-interfacing protrusion comprises a solder-wettable material.

20. The solder removal apparatus of claim 19 , wherein the solder-wettable material comprises copper, tin, gold, silver, nickel, or a combination thereof.

Assignees

• Micron Technology Inc

Inventors

• Tuttle Mark E

Classifications

• H10W72/071

  Connecting or disconnecting · CPC title

• H10W72/0711

  Apparatus therefor · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10P74/273

  Interconnections for measuring or testing, e.g. probe pads · CPC title

• H10P70/50

  characterised by the part to be cleaned · CPC title