Substrate cleaning device
US-11517940-B2 · Dec 6, 2022 · US
Operations & Transport
Operations & Transport · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B08B1/007 |
| Official title | — |
| Display label | Operations & Transport (mapped technology topic) |
| Total patents | 93 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 4 |
| 2016 | 5 |
| 2017 | 8 |
| 2018 | 12 |
| 2019 | 5 |
| 2020 | 13 |
| 2021 | 10 |
| 2022 | 15 |
| 2023 | 13 |
| 2024 | 8 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Compositions and methods for reducing interaction between abrasive particles and a cleaning brush
US-11446708-B2 · Sep 20, 2022 · US
Protecting the display of a device when cleaning with a cloth/material
US-11351577-B1 · Jun 7, 2022 · US
System for cleaning semiconductor wafers
US-2021402444-A1 · Dec 30, 2021 · US
System for cleaning semiconductor wafers
US-11141762-B2 · Oct 12, 2021 · US
Coating Machine, Coating System and Cleaning Method for Coating Machine
US-2021308729-A1 · Oct 7, 2021 · US
Scraping device for joining material and method for manufacturing segment joint body
US-2021276200-A1 · Sep 9, 2021 · US
Semiconductor wafer cleaning apparatus
US-2021233766-A1 · Jul 29, 2021 · US
Semiconductor wafer cleaning apparatus
US-10991570-B2 · Apr 27, 2021 · US
Cleaning device for hemming roller
US-2021094078-A1 · Apr 1, 2021 · US
Apparatus for axial disentanglement of debris from a mechanical agitator
US-2021094077-A1 · Apr 1, 2021 · US
System for cleaning wafer in cmp process of semiconductor manufacturing fabrication
US-2021060624-A1 · Mar 4, 2021 · US
Substrate cleaning apparatus and substrate cleaning method
US-2021039142-A1 · Feb 11, 2021 · US
Substrate cleaning device, substrate cleaning apparatus, method for manufacturing cleaned substrate and substrate processing apparatus
US-10879086-B2 · Dec 29, 2020 · US
System for cleaning wafer in CMP process of semiconductor manufacturing fabrication
US-10864557-B2 · Dec 15, 2020 · US
Substrate treatment apparatus
US-10821483-B2 · Nov 3, 2020 · US
Cleaning system for a polishing film
US-10814356-B2 · Oct 27, 2020 · US
Cleaning member attaching part, cleaning member assembly and substrate cleaning apparatus
US-2020276619-A1 · Sep 3, 2020 · US
Self-cleaning device and substrate processing apparatus
US-10751761-B2 · Aug 25, 2020 · US
Substrate cleaning apparatus and substrate processing facility having the same
US-10665477-B2 · May 26, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B08B1/007?
- CPC B08B1/007 is the Cooperative Patent Classification code for “Operations & Transport.”
- How many patents are filed under CPC B08B1/007 (Operations & Transport)?
- Our database includes 93 publications tagged with this CPC code.
- Is patent activity under CPC B08B1/007 growing?
- Publication counts under this code: 13 in 2023 vs 8 in 2024 (latest complete years).