Substrate cleaning apparatus and substrate processing facility having the same

Patent metadata

Field	Value
Publication number	US-10665477-B2
Application number	US-201615392008-A
Country	US
Kind code	B2
Filing date	Dec 28, 2016
Priority date	Feb 26, 2016
Publication date	May 26, 2020
Grant date	May 26, 2020

Abstract

A substrate cleaning apparatus includes a porous suction part having a polygonal pillar shape with a plurality of cleaning surfaces, a transfer unit to transfer a substrate with a plurality of semiconductor devices toward the porous suction part, and to contact the semiconductor devices with one of the plurality of cleaning surfaces, and a rotation driving part to rotate the porous suction part.

First claim

What is claimed is:

1. A substrate cleaning apparatus, comprising:
a porous suction part having a polygonal pillar shape with a plurality of cleaning surfaces;
a transfer unit to transfer a substrate with a plurality of semiconductor devices toward the porous suction part, and to contact the semiconductor devices with one of the plurality of cleaning surfaces; and
a rotation driving part to rotate the porous suction part.

2. The substrate cleaning apparatus as claimed in claim 1 , wherein:
the plurality of cleaning surfaces of the porous suction part are flat, and
the transfer unit reciprocally moves the substrate parallel to the one of the cleaning surfaces, while the semiconductor devices are in contact with the one of the cleaning surfaces.

3. The substrate cleaning apparatus as claimed in claim 1 , further comprising a water tub that accommodates a cleaning water, at least a portion of the porous suction part being in the cleaning water.

4. The substrate cleaning apparatus as claimed in claim 3 , further comprising a water level gauge sensor to sense a water level of the cleaning water in the water tub.

5. The substrate cleaning apparatus as claimed in claim 3 , further comprising:
a feed pipe to provide the cleaning water to the water tub; and
a drain pipe to drain the cleaning water out of the water tub.

6. The substrate cleaning apparatus as claimed in claim 3 , further comprising a contaminant removal unit to provide vibration to the cleaning water and to remove contaminants from the porous suction part in the cleaning water.

7. The substrate cleaning apparatus as claimed in claim 6 , wherein the contaminant removal unit includes an ultrasonic vibrator.

8. The substrate cleaning apparatus as claimed in claim 3 , wherein the cleaning water includes deionized water.

9. The substrate cleaning apparatus as claimed in claim 1 , further comprising a contaminant removal unit to provide vibration to at least one of the cleaning surfaces which are not in contact with the semiconductor devices and to remove contaminant from the porous suction part.

10. The substrate cleaning apparatus as claimed in claim 1 , further comprising a water feed pipe inside the porous suction part, the water feed pipe including a plurality of discharge holes to discharge cleaning water flowing inside the water feed pipe.

11. The substrate cleaning apparatus as claimed in claim 1 , wherein the porous suction part includes a sponge.

12. The substrate cleaning apparatus as claimed in claim 1 , further comprising a controller to control the rotation driving part so as to periodically rotate the porous suction part at a predetermined angle.

13. The substrate cleaning apparatus as claimed in claim 1 , wherein the transfer unit is to contact the semiconductor devices on the substrate with one or more of the plurality of cleaning surfaces.

14. The substrate cleaning apparatus as claimed in claim 13 , wherein the plurality of cleaning surfaces are flat, a surface contact between each semiconductor device and a corresponding cleaning surface being linear.

15. The substrate cleaning apparatus as claimed in claim 13 , wherein the porous suction part is periodically rotatable.

16. The substrate cleaning apparatus as claimed in claim 13 , wherein the porous suction part is a sponge, and a water feed with a plurality of discharge holes extends through the sponge.

17. The substrate cleaning apparatus as claimed in claim 13 , wherein the transfer unit is movable parallel to the one of the cleaning surfaces, while the semiconductor devices are in contact with the one of the cleaning surfaces.

18. A substrate processing system, comprising:
a substrate cleaning apparatus to remove contaminants from semiconductor devices on a substrate; and
a drying apparatus to dry the substrate after the substrate cleaning substrate,
wherein the substrate cleaning apparatus includes:
a porous suction part having a polygonal pillar shape with a plurality of cleaning surfaces,
a transfer unit to transfer a substrate with a plurality of semiconductor devices toward the porous suction part, and to contact the semiconductor devices with one of the plurality of cleaning surfaces, and
a rotation driving part to rotate the porous suction part.

19. The substrate processing system as claimed in claim 18 , further comprising:
a detergent injection unit to inject a detergent solution toward the substrate after the substrate cleaning apparatus; and
a wash injection unit to inject a washing solution toward the substrate after the detergent injection unit.

20. The substrate processing system as claimed in claim 18 , wherein the substrate cleaning apparatus further comprises a controller to control the rotation driving part so as to periodically rotate the porous suction part at a predetermined angle.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Tea-Geon

Classifications

• B08B3/00

  Cleaning by methods involving the use or presence of liquid or steam (B08B9/00 takes precedence) · CPC title

• B08B3/12

  by sonic or ultrasonic vibrations · CPC title

• B08B3/102

  with means for agitating the liquid (by agitating the container B08B3/042, B08B3/044, B08B3/045, B08B3/06) · CPC title

• H10P72/0408

  for drying · CPC title

• H10P72/0412 Primary

  using mainly scrubbing means, e.g. brushes · CPC title