Substrate cleaning device, substrate cleaning apparatus, method for manufacturing cleaned substrate and substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-10879086-B2
Application number	US-201816019415-A
Country	US
Kind code	B2
Filing date	Jun 26, 2018
Priority date	Jul 19, 2013
Publication date	Dec 29, 2020
Grant date	Dec 29, 2020

Abstract

A substrate cleaning device 1 includes a substrate holding unit 10 configured to hold a substrate W, a first cleaning unit 11 having a first cleaning member 11a caused to come into contact with a first surface WA of the substrate W held by the substrate holding unit 10 to clean the first surface WA, a second cleaning unit 12 having a second cleaning member 12a caused to come into contact with the first surface WA of the substrate W held by the substrate holding unit 10 to clean the first surface WA, and a controller 50 configured to control the first and second cleaning units 11, 12 so that, when any one of the first cleaning member 11a and the second cleaning member 12a cleans the first surface WA of the substrate W held by the substrate holding unit 10, the other cleaning member is at a position apart from the substrate W held by the substrate holding unit 10.

First claim

What is claimed is:

1. A substrate cleaning device comprising:
a first sponge cleaning tool configured to clean a substrate;
a second sponge cleaning tool configured to clean the substrate;
a first self-cleaning unit configured to clean the first sponge cleaning tool;
a second self-cleaning unit configured to clean the second sponge cleaning tool;
a chamber configured to accommodate the first and second sponge cleaning tools and the first and second self-cleaning units; and
a pulling-out mechanism capable of pulling out the first self-cleaning unit with the first sponge cleaning tool with respect to the chamber thereby performing a maintenance of the first sponge cleaning tool disposed outside the chamber while cleaning the substrate with the second sponge cleaning tool inside the chamber.

2. The substrate cleaning device according to claim 1 ,
wherein each of the first and second sponge cleaning tools has a chemical flow passage therein, and the chemical flow passage is configured to have a chemical liquid flow therein.

3. The substrate cleaning device according to claim 1 , further comprising:
a chemical supply mechanism configured to supply a chemical liquid directly to an inside of each of the first and second sponge cleaning tools.

4. The substrate cleaning device according to claim 1 , further comprising:
a chemical supply mechanism configured to supply a chemical liquid directly to each of the first and second sponge cleaning tools,
wherein the chemical supply mechanism includes a supply pipe which supplies the chemical liquid to an exposed top surface of each of the first and second sponge cleaning tools.

5. The substrate cleaning device according to claim 1 , further comprising:
a first arm configured to support the first sponge cleaning tool, the first arm being in the chamber; and
a second arm configured to support the second sponge cleaning tool, the second arm being in the chamber.

6. The substrate cleaning device according to claim 1 ,
wherein the first self-cleaning unit is configured to include a first cleaning plate to which the first sponge cleaning tool is pressed and to include a first sponge cleaning nozzle which provides chemical liquid to the first sponge cleaning tool; and
wherein the second self-cleaning unit is configured to include a second cleaning plate to which the second sponge cleaning tool is pressed and to include a second sponge cleaning nozzle which provides chemical liquid to the second sponge cleaning tool.

7. The substrate cleaning device according to claim 1 , further comprising:
a controller configured to control the first and second sponge cleaning tools and the first and second self-cleaning units so that a first substrate is cleaned by the first sponge cleaning tool, then a second substrate is cleaned by the second sponge cleaning tool, wherein one of the first and second sponge cleaning tools, which is not used for cleaning the respective first or second substrate, is cleaned by the first or second self-cleaning unit.

8. The substrate cleaning device according to claim 1 ,
wherein the first cleaning sponge tool is a pencil-type pen sponge or a roll sponge; and
wherein the second cleaning sponge tool is a pencil-type pen sponge or a roll sponge.

9. The substrate cleaning device according to claim 6 ,
wherein the first self-cleaning unit is configured to include a first pure-water nozzle which provides pure water to the first sponge cleaning tool; and
wherein the second self-cleaning unit is configured to include a second pure-water nozzle which provides pure water to the second sponge cleaning tool.

10. The substrate cleaning device according to claim 1 ,
wherein the pulling-out mechanism is configured to include a first pulling-out mechanism which guides the first self-cleaning unit with the first sponge cleaning tool to the outside of the chamber and to include a second pulling-out mechanism which guides the second self-cleaning unit with the second sponge cleaning tool to the outside of the chamber.

11. A substrate cleaning apparatus comprising:
a plurality of the substrate cleaning devices according to claim 1 ;
wherein a first substrate cleaning device of the plurality of substrate cleaning devices is arranged on a first cleaning line and a second substrate cleaning device of the plurality of substrate cleaning devices is arranged on a second cleaning line separate from the first cleaning line;
the substrate cleaning apparatus further comprising:
a first drying device configured to dry a substrate which has been cleaned, the first drying device being arranged on the first cleaning line;
a second drying device configured to dry a substrate which has been cleaned, the second drying device being arranged on the second cleaning line;
a first robot hand configured to be able to perform access to the inside of each of the first and second substrate cleaning devices and the inside of each of the first and second drying devices; and
a second robot hand configured to be able to perform access to the inside of each of the first and second substrate cleaning devices and the inside of each of the first and second drying devices.

12. A substrate processing apparatus comprising:
the substrate cleaning apparatus according to claim 11 ; and
a substrate processing device configured to process a substrate before cleaning in the substrate cleaning apparatus.

13. A method for manufacturing a cleaned substrate, the method comprising the steps of:
providing the substrate cleaning device according to claim 1 with the substrate; and
cleaning the substrate in the substrate cleaning device.

Assignees

• Ebara Corp

Inventors

• Sakurai Takeshi
• Hirai Eiji
• Hamaura Kaoru
• Miyazaki Mitsuru
• Maruyama Koji

Classifications

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0412 Primary

  using mainly scrubbing means, e.g. brushes · CPC title

• B08B1/52

  using fluids · CPC title

• B08B1/007

  Operations & Transport · mapped topic

• H01L21/67046 Primary

  Electricity · mapped topic