Rolled copper or copper-alloy foil provided with roughened surface

Patent metadata

Field	Value
Publication number	US-9049795-B2
Application number	US-201214004794-A
Country	US
Kind code	B2
Filing date	Feb 10, 2012
Priority date	Mar 25, 2011
Publication date	Jun 2, 2015
Grant date	Jun 2, 2015

Abstract

Provided is a rolled copper or copper-alloy foil having a roughened surface, the rolled copper or copper-alloy foil subjected to roughening treatment with copper fine grains wherein a copper base plating layer is provided between the copper roughened layer and the rolled copper or copper-alloy foil. An object of the present invention is to provide a roughened rolled copper-alloy foil having fewer craters, the presence of which is a serious disadvantage unique to a rolled copper-alloy foil having a roughened surface. In particular, provided is a rolled copper or copper-alloy foil in which the development of craters caused by inclusions present in or near a surface of the base material can be controlled.

First claim

The invention claimed is:

1. A rolled copper or copper-alloy foil provided with a roughened surface, the rolled copper or copper-alloy foil subjected to roughening treatment with copper fine grains wherein a copper base plating layer is provided between the copper roughened layer and the rolled copper or rolled copper-alloy foil, the copper base plating layer having a thickness of 0.15 to 0.30 μm.

2. The rolled copper or copper-alloy foil according to claim 1 , wherein the copper fine grains of the copper roughened layer are of a size between 0.25 μm and 0.45 μm inclusive.

3. The rolled copper or copper-alloy foil according to claim 1 , wherein a roughened layer comprising Co—Ni—Cu fine grains of between 0.05 μm and 0.25 μm inclusive is provided on the copper roughened layer obtained by roughening treatment with the copper fine grains.

4. The rolled copper or copper-alloy foil according to claim 3 , wherein the Co—Ni—Cu grains have a composition of Cu: 10 to 30 mg/dm 2 , Ni: 50 to 500 μg/dm 2 , and Co: 100 to 3,000 μg/dm 2 .

5. The rolled copper or copper-alloy foil according to claim 1 , wherein the roughened surface has 4.2 craters or less per 25 mm 2 .

6. The rolled copper or copper-alloy foil according to claim 1 , wherein the roughened surface has 0.5 craters or less per 25 mm 2 .

7. A rolled copper or copper-alloy foil provided with a roughened surface, the rolled copper or copper-alloy foil subjected to roughening treatment with copper fine grains wherein a copper base plating layer is provided between a first copper roughened layer of the copper fine grains and the rolled copper or rolled copper-alloy foil, and wherein a second roughened layer comprising Co—Ni—Cu fine grains of a size of 0.05 to 0.25 μm is further provided on the first copper roughened layer of the copper fine grains.

8. The rolled copper or copper-alloy foil according to claim 7 , wherein the second roughened layer of the Co—Ni—Cu fine grains has a composition of Cu: 10 to 30 mg/dm 2 , Ni: 50 to 500 μg/dm 2 , and Co: 100 to 3,000 μg/dm 2 .

9. The rolled copper or copper-alloy foil according to claim 8 , wherein the copper base plating layer has a thickness of 0.15 to 0.30 μm.

10. The rolled copper or copper-alloy foil according to claim 9 , wherein the copper fine grains of the first copper roughened layer are of a size of 0.25 to 0.45 μm.

11. The rolled copper or copper-alloy foil according to claim 10 , wherein the roughened surface has 4.2 craters or less per 25 mm 2 .

12. The rolled copper or copper-alloy foil according to claim 10 , wherein the roughened surface has 0.5 craters or less per 25 mm 2 .

13. A rolled copper or copper-alloy foil provided with a roughened surface, the rolled copper or copper-alloy foil subjected to roughening treatment with copper fine grains wherein a copper base plating layer is provided between a copper roughened layer of the copper fine grains and the rolled copper or rolled copper-alloy foil, and the roughened surface having 4.2 craters or less per 25 mm 2 .

14. The rolled copper or copper-alloy foil according to claim 13 , wherein the roughened surface has 0.5 craters or less per 25 mm 2 .

15. The rolled copper or copper-alloy foil according to claim 13 , further comprising a second roughened layer provided on the copper roughened layer obtained by roughening treatment with the copper fine grains.

16. The rolled copper or copper-alloy foil according to claim 15 , wherein the second roughened layer comprises Co—Ni—Cu fine grains of a size of 0.05 to 0.25 and a composition of Cu: 10 to 30 mg/dm 2 , Ni: 50 to 500 μg/dm 2 , and Co: 100 to 3,000 μg/dm 2 .

17. The rolled copper or copper-alloy foil according to claim 16 , wherein the roughened surface formed by the first and second roughened layers has 0.5 craters or less per 25 mm 2 .

Assignees

• Arai Hideta
• Miki Atsushi
• Jx Nippon Mining & Metals Corp

Inventors

• Arai Hideta
• Miki Atsushi

Classifications

• C25D7/0614

  Strips or foils · CPC title

• C25D3/38

  of copper · CPC title

• C25D5/10 Primary

  Electroplating with more than one layer of the same or of different metals (for bearings C25D7/10) · CPC title

• H05K1/09 Primary

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K2201/0355

  Metal foils · CPC title