Silver electroplating compositions and methods for electroplating rough matt silver
US-2024003037-A1 · Jan 4, 2024 · US
Surface topography of the layers, e.g. rough, dendritic or nodular layers
Surface topography of the layers, e.g. rough, dendritic or nodular layers · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C25D5/605 |
| Official title | {Surface topography of the layers, e.g. rough, dendritic or nodular layers} |
| Display label | Surface topography of the layers, e.g. rough, dendritic or nodular layers |
| Total patents | 382 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 41 |
| 2016 | 29 |
| 2017 | 33 |
| 2018 | 42 |
| 2019 | 41 |
| 2020 | 25 |
| 2021 | 35 |
| 2022 | 37 |
| 2023 | 31 |
| 2024 | 37 |
| 2025 | 27 |
| 2026 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US-9523155-B2 · Dec 20, 2016 · US
Reinforced porous metal foil and process for production thereof
US-9512527-B2 · Dec 6, 2016 · US
Carrier-Attached Copper Foil, Laminate, Printed-Wiring Board And Method For Manufacturing The Printed Wiring Board
US-2016353581-A1 · Dec 1, 2016 · US
Electroconductive material with an undulating surface, an electrical terminal formed of said material, and a method of producing said material
US-2016344127-A1 · Nov 24, 2016 · US
Geometry and process optimization for ultra-high RPM plating
US-9481942-B2 · Nov 1, 2016 · US
Electroconductive material for connection component
US-9449728-B2 · Sep 20, 2016 · US
Metal tube, heat transfer tube, heat exchange device, and method for manufacturing metal tube
US-2016252309-A1 · Sep 1, 2016 · US
Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board
US-2016234935-A1 · Aug 11, 2016 · US
Geometry and process optimization for ultra-high rpm plating
US-2016222535-A1 · Aug 4, 2016 · US
Method of modifying a sample surface layer from a microscopic sample
US-2016199878-A1 · Jul 14, 2016 · US
Method for producing a mating-type connecting part
US-9373925-B2 · Jun 21, 2016 · US
Plated polymer aviation components
US-2016167791-A1 · Jun 16, 2016 · US
Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
US-2016157356-A1 · Jun 2, 2016 · US
Edgeless pulse plating and metal cleaning methods for solar cells
US-9328427-B2 · May 3, 2016 · US
Metal-and-resin composite and method for making same
US-2016107342-A1 · Apr 21, 2016 · US
Copper foil structure having blackened ultra-thin foil and manufacturing method thereof
US-9258900-B2 · Feb 9, 2016 · US
Plating film, method of manufacturing plating film, and plated product
US-2016032478-A1 · Feb 4, 2016 · US
Preferred oriented au film, method for preparing the same and bonding structure comprising the same
US-2016024678-A1 · Jan 28, 2016 · US
Hierarchical structured surfaces
US-2015375997-A1 · Dec 31, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C25D5/605?
- CPC C25D5/605 is the Cooperative Patent Classification code for “Surface topography of the layers, e.g. rough, dendritic or nodular layers.”
- How many patents are filed under CPC C25D5/605 (Surface topography of the layers, e.g. rough, dendritic or nodular layers)?
- Our database includes 382 publications tagged with this CPC code.
- Is patent activity under CPC C25D5/605 growing?
- Publication counts under this code: 37 in 2024 vs 27 in 2025 (latest complete years).