Copper foil for printed circuit
US-9580829-B2 · Feb 28, 2017 · US
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Arai Hideta — Cross-Sectional Technologies
Arai Hideta holds 3 patents in Cross-Sectional Technologies, with representative filings summarized below.
| Metric | Value |
|---|---|
| Company | Arai Hideta |
| Technology | Cross-Sectional Technologies |
| Patents in slice | 3 |
| Recent patents in slice | 0 |
| First year | 2015 |
| Last year | 2017 |
Representative patents
Notable publications linking Arai Hideta to Cross-Sectional Technologies.
Recent filings
Latest patents from Arai Hideta in Cross-Sectional Technologies.
Copper foil for printed circuit
US-9580829-B2 · Feb 28, 2017 · US
Liquid crystal polymer copper-clad laminate and copper foil used for said laminate
US-9060431-B2 · Jun 16, 2015 · US
Rolled copper or copper-alloy foil provided with roughened surface
US-9049795-B2 · Jun 2, 2015 · US
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