Magnetic-field melting solder, and joining method in which same is used
US-2022402057-A1 · Dec 22, 2022 · US
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Senju Metal Industry Co patents in 2022
Senju Metal Industry Co was listed as an assignee on 48 patent publications in 2022.
| Metric | Value |
|---|---|
| Company | Senju Metal Industry Co |
| Year | 2022 |
| Patents | 48 |
Patents
Representative publications for Senju Metal Industry Co in 2022.
Flux and solder paste
US-2022402079-A1 · Dec 22, 2022 · US
Solder alloy, solder paste, solder ball, solder preform, solder joint, in-vehicle electronic circuit, ecu electronic circuit, in-vehicle electronic circuit device and ecu electronic circuit device
US-2022355420-A1 · Nov 10, 2022 · US
Core material, electronic component and method for forming bump electrode
US-11495566-B2 · Nov 8, 2022 · US
Joining material, production method for joining material, and joined body
US-2022347745-A1 · Nov 3, 2022 · US
Top CPC classifications
Most common classification codes for Senju Metal Industry Co in 2022.
| CPC | Patents |
|---|---|
| B23K35/262 | 33 |
| C22C13/00 | 25 |
| B23K35/025 | 23 |
| C22C13/02 | 22 |
| B23K35/0244 | 20 |
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