Solder composition and electronic board
US-2019015937-A1 · Jan 17, 2019 · US
US2022402079A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2022402079-A1 |
| Application number | US-202217833928-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jun 7, 2022 |
| Priority date | Jun 9, 2021 |
| Publication date | Dec 22, 2022 |
| Grant date | — |
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A flux containing: a rosin; a solvent (S); a thixotropic agent; and an activator is disclosed. The rosin contains a rosin amine. The solvent (S) contains a first solvent (S1) having a boiling point of 250° C. or less, and the amount of the first solvent (S1) relative to the total amount of the solvent (S) is 50% by mass or more and 100% by mass or less.
Opening claim text (preview).
What is claimed is: 1 . A flux comprising: a rosin; a solvent (S); a thixotropic agent; and an activator, wherein the rosin comprises a rosin amine, the solvent (S) comprises a first solvent (S1) having a boiling point of 250° C. or less, and an amount of the first solvent (S1) relative to a total mass of the solvent (S) is 50% by mass or more and 100% by mass or less. 2 . The flux according to claim 1 , where the boiling point of the first solvent (S1) is 150° C. or more and 250° C. or less. 3 . The flux according to claim 1 , wherein the solvent (S) further comprises a second solvent (S2) having a boiling point exceeding 250° C. 4 . The flux according to claim 1 , wherein the rosin amine comprises dehydroabietylamine. 5 . The flux according to claim 4 , wherein the rosin amine further comprises dihydroabietylamine. 6 . A solder paste comprising: a solder alloy powder; and a flux of claim 1 .
with organic compounds as principal constituents · CPC title
Selection of compositions of fluxes (B23K35/365, B23K35/368 take precedence) · CPC title
Polymers, e.g. resins · CPC title
Pastes, creams or slurries · CPC title
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