Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound
US-10192801-B2 · Jan 29, 2019 · US
Chen Kang holds 14 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 14 |
| Recent patents | 0 |
| First publication | Jul 14, 2015 |
| Latest publication | Jan 29, 2019 |
Year-over-year patent counts for this assignee.
Latest publications where this party is an assignee.
US-10192801-B2 · Jan 29, 2019 · US
US-9865482-B2 · Jan 9, 2018 · US
US-9679863-B2 · Jun 13, 2017 · US
US-9601434-B2 · Mar 21, 2017 · US
US-9484259-B2 · Nov 1, 2016 · US
Representative or frequently cited publications from precomputed assignee stats.
US-10192801-B2 · Jan 29, 2019 · US
US-9865482-B2 · Jan 9, 2018 · US
US-9679863-B2 · Jun 13, 2017 · US
US-9601434-B2 · Mar 21, 2017 · US
US-9484259-B2 · Nov 1, 2016 · US
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H01L2924/13091 | 13 |
| H10W74/00 | 12 |
| H01L2924/01322 | 11 |
| H01L2924/00 | 11 |
| H10W90/724 | 10 |
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 14 |
| Cross-Sectional Technologies | 1 |