Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound
US-10192801-B2 · Jan 29, 2019 · US
This page is not indexed by search engines while we improve data quality.
Chen Kang patents in 2019
Chen Kang was listed as an assignee on 1 patent publication in 2019.
| Metric | Value |
|---|---|
| Company | Chen Kang |
| Year | 2019 |
| Patents | 1 |
Patents
Representative publications for Chen Kang in 2019.
Top CPC classifications
Most common classification codes for Chen Kang in 2019.
| CPC | Patents |
|---|---|
| H01L21/486 | 1 |
| H01L21/76898 | 1 |
| H01L2224/04042 | 1 |
| H01L2224/0554 | 1 |
| H01L2224/0555 | 1 |
Related pages
Navigate to parent entity pages.