Semiconductor device and method of forming interconnect substrate for FO-WLCSP

Patent metadata

Field	Value
Publication number	US-9679863-B2
Application number	US-201113243214-A
Country	US
Kind code	B2
Filing date	Sep 23, 2011
Priority date	Sep 23, 2011
Publication date	Jun 13, 2017
Grant date	Jun 13, 2017

Abstract

A semiconductor device has a first encapsulant deposited over a first carrier. A plurality of conductive vias is formed through the first encapsulant to provide an interconnect substrate. A first semiconductor die is mounted over a second carrier. The interconnect substrate is mounted over the second carrier adjacent to the first semiconductor die. A second semiconductor die is mounted over the second carrier adjacent to the interconnect substrate. A second encapsulant is deposited over the first and second semiconductor die, interconnect substrate, and second carrier. A first interconnect structure is formed over a first surface of the second encapsulant and electrically connected to the conductive vias. A second interconnect structure is formed over a second surface of the second encapsulant and electrically connected to the conductive vias to make the Fo-WLCSP stackable. Additional semiconductor die can be mounted over the first and second semiconductor die in a PoP arrangement.

First claim

What is claimed:

1. A semiconductor device, comprising:
an interconnect substrate including,
(a) a first encapsulant base material,
(b) a conductive layer formed over a major surface of the first encapsulant base material and extending over a side surface of the first encapsulant base material within an opening in the first encapsulant base material, and
(c) an insulating material disposed in the opening in the first encapsulant base material over the conductive layer;

a first semiconductor die disposed adjacent to the interconnect substrate including a first surface of the first semiconductor die coplanar with a first surface of the interconnect substrate and a second surface of the first semiconductor die opposite the first surface coplanar with a second surface of the interconnect substrate opposite the first surface of the interconnect substrate;
a second encapsulant deposited completely around the first semiconductor die and further around an exterior perimeter of the interconnect substrate including a first surface of the second encapsulant coplanar with the first surface of the interconnect substrate and a second surface of the second encapsulant opposite the first surface coplanar with the second surface of the interconnect substrate;
a first interconnect structure formed over a first surface of the second encapsulant and electrically connected to the conductive layer of the interconnect substrate; and
a second interconnect structure formed under a second surface of the second encapsulant opposite the first surface of the second encapsulant.

2. The semiconductor device of claim 1 , wherein the second interconnect structure is electrically connected to the conductive layer of the interconnect substrate.

3. The semiconductor device of claim 2 , further including a plurality of stacked semiconductor devices electrically connected through the first and second interconnect structures and interconnect substrate.

4. The semiconductor device of claim 1 , further including a second semiconductor die disposed over the first semiconductor die.

5. The semiconductor device of claim 1 , wherein the first encapsulant contains greater than 51% silica filler.

Assignees

• Lin Yaojian
• Fang Jianmin
• Feng Xia
• Chen Kang
• Stats Chippac Pte Ltd

Inventors

• Lin Yaojian
• Fang Jianmin
• Feng Xia
• Chen Kang

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W70/09

  extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs · CPC title

• H10W72/07236

  Soldering or alloying · CPC title

• H10W70/093

  Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps · CPC title