Method for ultrasonic welding with particles trapping

US9975194B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9975194-B2
Application numberUS-201615067779-A
CountryUS
Kind codeB2
Filing dateMar 11, 2016
Priority dateSep 17, 2013
Publication dateMay 22, 2018
Grant dateMay 22, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention relates to a method of connecting two components by ultrasonic welding for producing a power semiconductor module, said method comprising the steps of: a) Aligning the components to be welded to form a welding interface; b) Aligning a welding tool to the aligned components; c) Removably arranging a trapping material at least partly encompassing the welding interface, whereby the trapping material is a foam; and d) Connecting the components by activating the welding tool. The method like described above provides an easy and cost-saving measure in order to prevent particle contamination when performing a welding process such as particularly an ultrasonic welding process sue to scattered particles.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of connecting two components by ultrasonic welding for producing a power semiconductor module, said method comprising the steps of: a) aligning the components to be welded to form a welding interface; b) aligning a welding tool to the aligned components; c) removably arranging a trapping material at least partly encompassing the welding interface, whereby the trapping material is a foam; and d) connecting the components by activating the welding tool, wherein pockets of the foam are filled with an inert gas or with a surfactant. 2. The method according to claim 1 , wherein step c) further comprises removably arranging the trapping material at least partly encompassing the welding interface and in contact with the welding interface; and wherein step d) further comprises connecting the components by activating the welding tool after removably arranging the foam trapping material. 3. The method according to claim 1 , wherein step c) further comprises removably arranging the trapping material at least partly encompassing the welding interface and in contact with at least one of the components, wherein step c) is performed before step b). 4. The method according to claim 2 , wherein step c) is performed after step b). 5. The method according to claim 2 , wherein said method comprises the further step: e) performing a cleaning procedure after the welding step. 6. The method according to claim 1 , wherein said method comprises the further step e) performing a cleaning procedure after the welding step. 7. The method according to claim 6 , wherein the performing a cleaning procedure comprises application of a solvent, application of a defoaming agent, wet cleaning, air sucking, air blowing, evaporating and/or burning. 8. The method according to claim 2 , wherein the method comprises the further step: f) pretreating at least one surface of at least one of the components with a surface tension lowering material. 9. The method according to claim 2 , wherein step d) is performed at a temperature lying in the range of ≥10° C. to ≤80° C. 10. The method according to claim 1 , wherein step d) is performed at a pressure lying in the range of ≥1 mbar to ≤6 bar. 11. The method according to claim 1 , wherein step d) is performed under an atmosphere comprising an inert gas. 12. The method according to claim 1 , wherein the components to be welded are formed from a metal or a polymer. 13. The method of claim 1 , wherein step c) is performed before step b). 14. The method according to claim 1 , wherein step c) is performed after step b). 15. The method according to claim 3 , wherein said method comprises the further step e) performing a cleaning procedure after the welding step. 16. The method according to claim 1 , wherein the method comprises the further step f) pretreating at least one surface of at least one of the components with a surface tension lowering material. 17. The method according to claim 16 , wherein the at least one surface is coated with a polymeric material. 18. The method according to claim 3 , wherein the method comprises the further step f) pretreating at least one surface of at least one of the components with a surface tension lowering material. 19. The method according to claim 1 , wherein step d) is performed at a temperature lying in the range of ≥10° C. to ≤80° C. 20. The method according to claim 3 , wherein step d) is performed at a temperature lying in the range of ≥10° C. to ≤80° C.

Assignees

Inventors

Classifications

  • Auxiliary equipment · CPC title

  • using ultrasonic or sonic vibrations · CPC title

  • B23K1/06Primary

    making use of vibrations, e.g. supersonic vibrations · CPC title

  • B23K20/10Primary

    making use of vibrations, e.g. ultrasonic welding · CPC title

  • specially adapted for particular articles or work (B23K20/129 takes precedence) · CPC title

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What does patent US9975194B2 cover?
The present invention relates to a method of connecting two components by ultrasonic welding for producing a power semiconductor module, said method comprising the steps of: a) Aligning the components to be welded to form a welding interface; b) Aligning a welding tool to the aligned components; c) Removably arranging a trapping material at least partly encompassing the welding interface, where…
Who is the assignee on this patent?
Abb Technology Ag, Abb Schweiz Ag
What technology area does this patent fall under?
Primary CPC classification B23K1/06. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 22 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).