Electrical connection element

Patent metadata

Field	Value
Publication number	US-2016309588-A1
Application number	US-201615197298-A
Country	US
Kind code	A1
Filing date	Jun 29, 2016
Priority date	Jul 13, 2010
Publication date	Oct 20, 2016
Grant date	—

Abstract

An electrical connection element is described. The connection element contains at least an iron-nickel alloy or an iron-nickel-cobalt alloy.

First claim

We claim:

1 . A pane comprising:
a glass substrate; an electrically conductive structure having a layer thickness of 5 μm to 40 μm on a region of the glass substrate; a connection element; a layer of a solder material electrically connecting the connection element to a portion of the electrically conductive structure,
wherein the connection element contains at least an iron-nickel alloy or an iron-nickel-cobalt alloy,
wherein the connection element is connected to the portion of the electrically conductive structure via a contact surface over an entire surface of the connection element, and
wherein the contact surface has no corners.

2 . The pane according to claim 1 , wherein the connection element contains at least 50 wt.-% to 75 wt.-% iron, 25 wt.-% to 50 wt.-% nickel, 0 wt.-% to 20 wt.-% cobalt, 0 wt.-% to 1.5 wt.-% magnesium, 0 wt.-% to 1 wt.-% silicon, 0 wt.-% to 1 wt.-% carbon, or 0 wt.-% to 1 wt.-% manganese.

3 . The pane according to claim 1 , wherein the contact surface has an oval, elliptical or a circular structure.

4 . The pane according to claim 1 , wherein the contact surface has a convex polygonal shape with rounded corners, the rounded corners having a radius of greater than 0.5 mm.

5 . The pane according to claim 1 , wherein the connection element contains at least 55 wt.-% to 70 wt.-% iron, 30 wt.-% to 45 wt.-% nickel, 0 wt.-% to 5 wt.-% cobalt, 0 wt.-% to 1 wt.-% magnesium, 0 wt.-% to 1 wt.-% silicon, or 0 wt.-% to 1 wt.-% carbon.

6 . The pane according to claim 5 , wherein the glass substrate has a first coefficient of thermal expansion, and the connection element has a second coefficient of thermal expansion, wherein the difference between the first coefficient of thermal expansion and the second coefficient of thermal expansion is ≧5×10 −6 /° C.

7 . The pane according to claim 1 , wherein the connection element contains at least 50 wt.-% to 60 wt.-% iron, 25 wt.-% to 35 wt.-% nickel, 15 wt.-% to 20 wt.-% cobalt, 0 wt.-% to 0.5 wt.-% silicon, 0 wt.-% to 0.1 wt.-% carbon, or 0 wt.-% to 0.5 wt.-% manganese.

8 . The pane according to claim 7 , wherein the glass substrate has a first coefficient of thermal expansion, and the connection element has a second coefficient of thermal expansion, wherein the difference between the first coefficient of thermal expansion and the second coefficient of thermal expansion is <5×10 −6 /° C.

9 . The pane according to claim 1 , wherein the solder material flows out from an intermediate space between the connection element and the electrically conductive structure with an outflow width of less than 1 mm.

10 . The pane according to claim 1 , wherein the solder material contains tin and bismuth, indium, zinc, copper, silver, or compositions thereof.

11 . The pane according to claim 10 , wherein the tin in the solder composition is 3 wt.-% to 99.5 wt.-%, and the bismuth, indium, zinc, copper, silver, or compositions thereof are each 0.5 wt.-% to 97 wt.-%.

12 . The pane according to claim 1 , wherein the connection element is coated with nickel, tin, copper, and/or silver.

13 . The pane according to claim 12 , wherein the connection element is coated with 0.1 μm to 0.3 μm nickel and/or 3 μm to 10 μm silver.

Assignees

• Saint Gobain

Inventors

• Cholewa Harald
• Schlarb Andreas
• Lesmeister Lothar
• Rateiczak Mitja
• Reul Bernhard
• Schmidt Lothar

Classifications

• H05B2203/016

  Heaters using particular connecting means · CPC title

• H05K2201/068

  wherein the coefficient of thermal expansion is important · CPC title

• B23K35/36

  Selection of non-metallic compositions, e.g. coatings or fluxes (B23K35/34 takes precedence); Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest · CPC title

• H01R43/16

  for manufacturing contact members, e.g. by punching and by bending · CPC title

• H05K1/11

  Printed elements for providing electric connections to or between printed circuits · CPC title