Techniques for joining one or more structures of an electronic device

Patent metadata

Field	Value
Publication number	US-2016342179-A1
Application number	US-201615160054-A
Country	US
Kind code	A1
Filing date	May 20, 2016
Priority date	May 20, 2015
Publication date	Nov 24, 2016
Grant date	—

Abstract

Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region.

First claim

What is claimed is:

1 . A method for forming an electronic device having an enclosure comprising a first part and a second part rotatably coupled with the first part, the second part comprising a magnet, the method comprising:
engaging an attachment feature with a bonding tool configured to bond the attachment feature with the first part; and actuating the attachment feature via the bonding tool that causes a solder material disposed between the attachment feature and the first part to melt and bond the attachment feature with the first part.

2 . The method of claim 1 , wherein in a closed configuration between the first part and the second part, the attachment feature magnetically couples with the magnet to define a magnetic circuit, and the first part is separated from the second part by a gap that is based upon the magnetic circuit.

3 . The method of claim 1 , further comprising co-planarizing the attachment feature and the enclosure.

4 . The method of claim 1 , wherein the solder material is disposed in a channel of the enclosure and wherein the attachment feature is at least partially disposed in the channel.

5 . The method of claim 4 , further comprising disposing a potting material in the channel, wherein the potting material is co-planar with respect to an uppermost surface of the enclosure.

6 . The method of claim 1 , wherein the first part comprises first type metal having a first hardness and the attachment feature comprises a second type metal having a second hardness greater than the first hardness.

7 . The method of claim 1 , wherein actuating the attachment feature via the bonding tool to bond the attachment feature with the first part comprises bonding the attachment feature along a corner region of the first part, and wherein the magnet is secured with a corner region of the second part, the corner region of the second part corresponding to the corner region of the first part.

8 . A method for solid-state bonding a first part with a second part at a joint region, the first part formed of a first type material and the second part formed from a second type material dissimilar to the first type material, the method comprising:
applying a force by a bonding tool to the first part when the first part is in contact with the second part at the joint region; and actuating, by the bonding tool, the first part in a repeated manner with respect to the second part in a first direction and subsequently in a second direction opposite the first direction such that at least some of the first type material intermingles with at least some of the second type material within the joint region while applying the force.

9 . The method of claim 8 , wherein actuating the first part, in the repeated manner, comprises actuating the first part back and forth in a linear motion.

10 . The method of claim 8 , wherein actuating the first part, in the repeated manner, comprises actuating the first part back and forth in a partially circular motion.

11 . The method of claim 8 , wherein the first part comprises a beam feature that increases a structural rigidity of the second part.

12 . The method of claim 11 , further comprising:
actuating the bonding tool; and engaging a second region of the first part with the bonding tool to form a second joint region between the first part and the second part, the second joint region defining a second location in which the first part is bonded with the second part.

13 . The method of claim 11 , wherein the beam feature comprises a rib feature that engages the second part, and wherein the rib feature softens when the bonding tool actuates the beam feature to bond the beam feature with the second part.

14 . The method of claim 8 , wherein the first part comprises a protruding feature that includes an internal threaded region configured to receive a fastener that secures a component with the second part.

15 . The method of claim 8 , positioning an intermediate feature between the first part and the second part, wherein actuating, by the bonding tool, the first part in the repeated manner causes the intermediate feature to bond with the first part and the second part.

16 . An electronic device, comprising:
a base portion comprising a magnet; and a housing rotatably coupled with the base portion and formed from a first type metal, the housing comprising an attachment feature formed from a second type metal different from the first type metal, wherein in a closed configuration between the base portion and the housing, the second type metal causes the attachment feature to magnetically couple with the magnet to define a magnetic circuit, and the housing is separated from the base portion by a gap that is based upon the magnetic circuit.

17 . The electronic device of claim 16 , wherein the housing further comprises a protruding feature bonded with the housing, and wherein the protruding feature comprises an internal threaded region to secure a component with the housing.

18 . The electronic device of claim 17 , further comprising an intermediate feature, wherein the intermediate feature is directly bonded with the protruding feature and the housing.

19 . The electronic device of claim 16 , wherein the housing further comprises a beam feature bonded directly with the housing, and wherein the beam feature extends along an interior region of the housing to provide structural support to the housing.

20 . The electronic device of claim 19 , wherein the housing further comprises a cable assembly, and wherein the cable assembly extends through an underpass of the beam feature.

Assignees

• Apple Inc

Inventors

• Osborne Steven J
• Giddings Joss N
• Garelli Adam T
• Leggett William F
• Montplaisir Sarah J
• Corriveau Eric T
• Ewing Tyler J

Classifications

• B23K1/0016

  Soldering of electronic components · CPC title

• B23K2103/10

  Aluminium or alloys thereof · CPC title

• B23K2103/18

  Dissimilar materials · CPC title

• B23K2103/05

  Stainless steel · CPC title

• B23K20/2336

  both layers being aluminium · CPC title