Bonding apparatus

Patent metadata

Field	Value
Publication number	US-9711483-B2
Application number	US-201415028819-A
Country	US
Kind code	B2
Filing date	Oct 28, 2014
Priority date	Nov 7, 2013
Publication date	Jul 18, 2017
Grant date	Jul 18, 2017

Abstract

A bonding apparatus bonds a plurality of device chips on a plurality of electrode pads that are provided to a surface of a substrate. The bonding apparatus includes a stage, a head unit, a head lifting mechanism, a head vibrator, a heater, and a bonding region observation component. The substrate is placed and supported on the stage. The head unit holds the device chips. The head lifting mechanism raises and lowers the head unit in an up and down direction relative to the stage. The head vibrator vibrate the head unit in the up and down direction. The heater heats a bonding paste that bonds the device chips and the electrode pads. The bonding region observation component observes a region that includes at least a peripheral part of the electrode pads.

First claim

The invention claimed is:

1. A bonding apparatus for bonding a plurality of device chips on a plurality of electrode pads provided to a surface of a substrate, the bonding apparatus comprising:
a stage on which the substrate is placed and supported;
a head unit configured to hold the device chips to be bonded on the electrode pads;
a head lifting mechanism configured to raise and lower the head unit in an up and down direction relative to the stage;
a head vibrator configured to vibrate the head unit in the up and down direction;
a heater configured to heat a bonding paste that bonds the device chips and the electrode pads; and
a bonding region observation component configured to observe a region that includes at least a peripheral part of the electrode pads to which the device chips have been bonded,
the stage having a support member that is configured to support the substrate, the support member has a portion corresponding to the peripheral part of the electrode pads to which the device chips have been bonded and an outside part thereof, the portion of the support member being made from a transparent material,
the bonding region observation component being disposed opposite the head unit to sandwich the support member of the stage therebetween, and
the bonding region observation component including
an image signal acquisition component that is configured to acquire an image signal of an image observed with the bonding region observation component; and
a paste state tester that is configured to test a state of the bonding paste that touches the device chips based on the image signal.

2. The bonding apparatus according to claim 1 , wherein
the paste state tester is configured to test bulge distance of the bonding paste bulging out from a periphery of the device chips.

3. The bonding apparatus according to claim 2 , further comprising
a permissible bulge range setting component configured to set a permissible bulge range for the bulge distance of the bonding paste bulging out from an outer peripheral part of the electrode pads,
the paste state tester being configured to test whether or not the bulge distance of the bonding paste bulging out from the outer peripheral part of the electrode pads is within the permissible bulge range.

4. The bonding apparatus according to claim 3 , wherein
the paste state tester is configured to notify a user that the bulge distance of the tested bonding paste is abnormal if the bulge distance of the tested bonding paste is outside the permissible bulge range for at least one of the electrode pads.

5. The bonding apparatus according to claim 2 , further comprising:
a permissible bulge tipper limit setting component configured to set a permissible bulge upper limit for the bulge distance of the bonding paste bulging out from an outer peripheral part of the electrode pads; and
a controller configured to halt heating by the heater or raise the head unit if the paste state tester determines that the bonding paste bulging out from the outer peripheral part of the electrode pads has reached the permissible bulge upper limit.

6. The bonding apparatus according to claim 2 , further comprising:
a head pressurization component configured to pressurize the head unit toward the stage side;
a permissible bulge upper limit setting component configured to set a permissible bulge upper limit for the bulge distance of the bonding paste bulging out from an outer peripheral part of the electrode pads; and
a controller configured to halt pressurization by the head pressurization component if the paste state tester determines that the bonding paste bulging out from the outer peripheral part of the electrode pads has reached the permissible bulge upper limit.

7. The bonding apparatus according to claim 1 , wherein
the paste state tester is configured to test curing reaction state of the bonding paste.

8. The bonding apparatus according to claim 7 , further comprising
a curing reaction state permissible range setting component configured to set a permissible range of the curing reaction state of the bonding paste,
the paste state tester being configured to test whether or not the bonding paste is within the permissible range of the curing reaction state.

9. The bonding apparatus according to claim 8 , wherein
the paste state tester is configured to notify a user that the curing reaction state of the tested bonding paste is abnormal if the tested bonding paste is outside the permissible range of the curing reaction state for at least one of the electrode pads.

10. The bonding apparatus according to claim 7 , further comprising:
a permissible curing reaction state upper limit setting component configured to set a permissible upper limit for the curing reaction state of the bonding paste; and
a controller configured to halt heating by the heater or raise the head unit if the paste state tester determines that the bonding paste has reached the permissible upper limit for the curing reaction state.

11. The bonding apparatus according to claim 7 , further comprising:
a head pressurization component configured to pressurize the head unit toward the stage side;
a permissible curing reaction state upper limit setting component configured to set a permissible upper limit for the curing reaction state of the bonding paste; and
a controller configured to halt pressurization by the head pressurization component if the paste state tester determines that the bonding paste has reached the permissible upper limit for the curing reaction state.

12. The bonding apparatus according to claim 3 , further comprising:
a permissible bulge upper limit setting component configured to set a permissible bulge upper limit for the bulge distance of the bonding paste bulging out from an outer peripheral part of the electrode pads; and
a controller configured to halt heating by the heater or raise the head unit if the paste state tester determines that the bonding paste bulging out from the outer peripheral part of the electrode pads has reached the permissible bulge upper limit.

13. The bonding apparatus according to claim 4 , further comprising:
a permissible bulge upper limit setting component configured to set a permissible bulge upper limit for the bulge distance of the bonding paste bulging out from an outer peripheral part of the electrode pads; and
a controller configured to halt heating by the heater or raise the head unit if the paste state tester determines that the bonding paste bulging out from the outer peripheral part of the electrode pads has reached the permissible bulge upper limit.

14. The bonding apparatus according to claim 3 , further comprising:
a head pressurization component configured to pressurize the head unit toward the stage side;
a permissible bulge upper limit setting component configured to set a permissible bulge upper limit for the bulge distance of the bonding paste bulging out from an outer peripheral part of the electrode pads; and
a controller configured to halt pressurization by the head pressurization component if the paste state tester determines that the bonding paste bulging out from the outer peripheral part of the electrode pads has reached the permissible bulge upper limit.

15. The bonding apparatus according to claim 4 , further comprising:
a head pressurization component configured to pressurize the head unit toward the stage side;
a permissible bulge upper limit setting component configured to set a permissible bulge upper limit for the bulge distance of the bonding paste bulging out from an outer peripheral part of the electrode pads;

Assignees

• Toray Eng Co Ltd

Inventors

• Wada Hiromitsu

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07331

  Connecting techniques · CPC title

• H10W72/07183

  Means for monitoring · CPC title

• H10W72/07178

  Means for aligning · CPC title

• H10W72/07173

  Means for moving chips, wafers or other parts, e.g. conveyor belts · CPC title