Metal substrate structure for a semiconductor power module
US-12218192-B2 · Feb 4, 2025 · US
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Guillon David patents
Guillon David is listed as an inventor on 19 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Guillon David |
| Total patents | 19 |
| First publication | Jan 7, 2016 |
| Latest publication | Feb 4, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Power semiconductor device with free-floating packaging concept
US-12094791-B2 · Sep 17, 2024 · US
Semiconductor power module and method for manufacturing a semiconductor power module
US-2024186199-A1 · Jun 6, 2024 · US
Semiconductor power module and method for manufacturing a semiconductor power module
US-2024063080-A1 · Feb 22, 2024 · US
Semiconductor power module and method for manufacturing a semiconductor power module for a semiconductor device and semiconductor device
US-2023420271-A1 · Dec 28, 2023 · US
Metal Substrate Structure for a Semiconductor Power Module
US-2022344456-A1 · Oct 27, 2022 · US
Power Semiconductor Module and Method of Forming the Same
US-2022246577-A1 · Aug 4, 2022 · US
Power semiconductor module embedded in a mold compounded with an opening
US-11362008-B2 · Jun 14, 2022 · US
Power Semiconductor Device with Free-Floating Packaging Concept
US-2021384091-A1 · Dec 9, 2021 · US
Power semiconductor module
US-10854524-B2 · Dec 1, 2020 · US
Recent patents
Latest publications not already listed above.
Power semiconductor module
US-2020144140-A1 · May 7, 2020 · US
Power semiconductor module
US-2019363029-A1 · Nov 28, 2019 · US
High voltage power electronics module for subsea applications under high hydrostatic pressure and temperature variations
US-9984948-B2 · May 29, 2018 · US
Method for ultrasonic welding with particles trapping
US-9975194-B2 · May 22, 2018 · US
Semiconductor module with ultrasonically welded terminals
US-9949385-B2 · Apr 17, 2018 · US
High Voltage Power Electronics Module For Subsea Applications
US-2017365535-A1 · Dec 21, 2017 · US
Method of generating a power semiconductor module
US-2017323801-A1 · Nov 9, 2017 · US
Method for ultrasonic welding with particles trapping
US-2016193678-A1 · Jul 7, 2016 · US
Semiconductor module with ultrasonically welded terminals
US-2016007485-A1 · Jan 7, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Abb Schweiz Ag | 8 |
| Hitachi Energy Switzerland Ag | 4 |
| Abb Technology Ag | 4 |
| Hitachi Energy Ltd | 3 |
| Hitachi Energy Switzerland Ag | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/754 | 7 |
| H10W74/016 | 6 |
| H01L21/565 | 6 |
| H10W70/6875 | 5 |
| H10W76/15 | 5 |