Processes for preventing oxidation of metal thin films

Patent metadata

Field	Value
Publication number	US-9947582-B1
Application number	US-201715612962-A
Country	US
Kind code	B1
Filing date	Jun 2, 2017
Priority date	Jun 2, 2017
Publication date	Apr 17, 2018
Grant date	Apr 17, 2018

Abstract

Processes are provided herein for protecting metal thin films from oxidation when exposed to an oxidizing environment, such as the ambient atmosphere. The processes may comprise a protective treatment including exposing the metal thin film to a silicon-containing precursor at a temperature of about 200° C. or less in order to selectively adsorb a silicon-containing protective layer on the metal thin film. The silicon-containing protective layer may reduce or substantially prevent the underlying metal thin film from oxidation.

First claim

What is claimed is:

1. A process for protecting a metal thin film from oxidation in an oxidizing environment comprising:
depositing a metal thin film on a substrate in a reaction chamber;
exposing the deposited metal thin film to a silicon-containing precursor at a process temperature of less than about 200° C. to thereby adsorb no more than about a monolayer of silicon-containing species on the metal thin film,
wherein the deposited metal thin film is exposed to the silicon-containing precursor prior to being exposed to an oxidizing environment.

2. The process of claim 1 , wherein the silicon-containing species are adsorbed on the metal thin film relative to a second, different surface of the substrate with a selectivity of greater than about 50%.

3. The process of claim 1 , wherein a thickness of the adsorbed silicon-containing monolayer is from about 0.1 nm to about 2 nm.

4. The process of claim 1 , wherein the silicon-containing precursor comprises an aminosilane compound.

5. The process of claim 1 , wherein the silicon-containing precursor comprises a silane compound.

6. The process of claim 5 , wherein the silicon-containing precursor comprises disilane.

7. The process of claim 1 , wherein the deposited metal thin film is exposed to the silicon-containing precursor for more than about 10 seconds.

8. The process of claim 1 , wherein the deposited metal thin film is exposed to the silicon-containing precursor for less than about 120 seconds.

9. The process of claim 1 , wherein the deposited metal thin film comprises W, Co, Cu, TiN, TaN, and/or a mixture thereof.

10. The process of claim 1 , wherein the deposited metal thin film comprises Co and/or W.

11. The process of claim 1 , wherein depositing the metal thin film and exposing the deposited metal thin film to the silicon-containing precursor steps are carried out in the same reaction chamber.

12. The process of claim 1 , wherein depositing the metal thin film and exposing the deposited metal thin film to the silicon-containing precursor steps are carried out in different reaction chambers.

13. A process for protecting a metal thin film from oxidation in an oxidizing environment comprising:
providing a metal thin film on a substrate comprising at least a dielectric surface in a reaction chamber;
exposing the metal thin film to a silicon-containing precursor at a process temperature of less than about 200° C. to thereby selectively adsorb no more than about a monolayer of silicon-containing species on the metal thin film relative to the dielectric surface of the substrate,
wherein the deposited metal thin film is exposed to the silicon containing precursor prior to being exposed to an oxidizing environment, and
wherein the silicon-containing species are adsorbed onto the metal thin film relative to the dielectric surface with a selectivity of greater than about 50%.

14. The process of claim 13 , wherein the silicon-containing precursor comprises a silane compound.

15. The process of claim 13 , wherein the deposited metal thin film is exposed to the silicon-containing precursor for more than about 10 seconds.

16. The process of claim 13 , wherein the deposited metal thin film comprises W, Co, Cu, TiN, TaN, and/or a mixture thereof.

17. The process of claim 16 , wherein the dielectric surface comprises a silicon-containing surface and/or a metal oxide surface.

18. The process of claim 17 , wherein the silicon-containing surface comprises SiO 2 , SiN, SiOC, SiON, and/or SiOCN.

19. The process of claim 17 , wherein the metal oxide surface comprises TiO 2 , Ta 2 O 5 , and/or Al 2 O 3 .

20. The process of claim 13 , wherein depositing the metal thin film and exposing the deposited metal thin film to the silicon-containing precursor steps are carried out in the same reaction chamber.

21. The process of claim 13 , wherein depositing the metal thin film and exposing the deposited metal thin film to the silicon-containing precursor steps are carried out in different reaction chambers.

Assignees

• Asm Ip Holding Bv

Inventors

• Kuroda Aurélie
• Chen Shang
• Onuma Takahiro
• Ishikawa Dai

Classifications

• H10P14/432

  using selective deposition · CPC title

• H10W20/425

  Barrier, adhesion or liner layers · CPC title

• H10W20/077

  on sidewalls or on top surfaces of conductors (H10W20/076 takes precedence) · CPC title

• H10W20/037 Primary

  the barrier, adhesion or liner layers being on top of a main fill metal · CPC title

• H01L21/76888 Primary

  Electricity · mapped topic