Piezoelectronic device with novel force amplification

Patent metadata

Field	Value
Publication number	US-9941472-B2
Application number	US-201414577279-A
Country	US
Kind code	B2
Filing date	Dec 19, 2014
Priority date	Mar 10, 2014
Publication date	Apr 10, 2018
Grant date	Apr 10, 2018

Abstract

A piezoelectronic device with novel force amplification includes a first electrode; a piezoelectric layer disposed on the first electrode; a second electrode disposed on the piezoelectric layer; an insulator disposed on the second electrode; a piezoresistive layer disposed on the insulator; a third electrode disposed on the insulator; a fourth electrode disposed on the insulator; a semi-rigid housing surrounding the layers and the electrodes; wherein the semi-rigid housing is in contact with the first, third, and fourth electrodes and the piezoresistive layer; wherein the semi-rigid housing includes a void. The third and fourth electrodes are on the same plane and separated from each other in the transverse direction by a distance.

First claim

What is claimed is:

1. A piezoelectric device, comprising:
a first electrode;
a piezoelectric layer disposed on the first electrode;
a second electrode disposed on the piezoelectric layer;
an insulator layer disposed on the second electrode;
a piezoresistive layer, having a top, a bottom, a left, and a right side, disposed on the insulator layer;
a third electrode, having a first portion and a second portion, disposed on the insulator layer;
a fourth electrode, having a first portion and a second portion, disposed on the insulator layer;
a semi-rigid housing, having a top, a bottom, and two sides;
wherein the semi-rigid housing surrounds the piezoelectric layer, the piezoresistive layer, the insulator layer, and the electrodes;
wherein the bottom of the semi-rigid housing is in contact with the first electrode and the top of the semi-rigid housing is in contact with the third and fourth electrodes and the piezoresistive layer;
wherein the first and second portion of the third electrode, the first and second portion of the fourth electrode, and the piezoresistive layer each have a yield strength;
wherein between the two sides of the semi-rigid housing and the layers and the electrodes is a void; and
wherein an applied voltage across the first and second electrodes causes a pressure from the piezoelectric layer to be applied to the piezoresistive layer through the insulator layer, such that an electrical resistance of the piezoresistive layer is dependent upon the pressure applied by the piezoelectric layer.

2. The device of claim 1 , wherein the third and fourth electrodes are coated with a layer of conducting film.

3. The device of claim 1 , wherein:
the first portion of the third electrode wraps the left side of the piezoresistive layer; and
the first portion of the fourth electrode wraps the right side of the piezoresistive layer.

4. The device of claim 3 , wherein:
the second portion of the third electrode is disposed on the top side of the piezoresistive layer; and
the second portion of the fourth electrode is disposed on the top side of the piezoresistive layer.

5. The device of claim 4 , wherein the semi-rigid housing is in contact with the second portions of the third and fourth electrodes.

6. The device of claim 5 , wherein a distance in the transverse direction separates the second portions of the third and fourth electrodes on the top side of the piezoresistive layer from each other.

7. The device of claim 6 , wherein the semi-rigid housing is in contact with the top side of the piezoresistive layer at the distance between the second portions of the electrodes.

8. The device of claim 5 , wherein between the semi-rigid housing and the first portions of the third and fourth electrodes is a void.

9. The device of claim 5 , wherein between the second and third electrodes is a connection forming a common electrode.

10. The device of claim 5 , wherein between the second and fourth electrodes is a connection forming a common electrode.

11. The device of claim 5 , wherein the first portions of the third and fourth electrodes have smaller yield strengths than the second portions of the third and fourth electrodes and the piezoresistive layer.

12. The device of claim 11 , wherein the second portions of the third and fourth electrodes are embedded in the semi-rigid housing.

13. The device of claim 3 , wherein:
the second portion of the third electrode wraps the bottom side of the piezoresistive layer; and
the second portion of the fourth electrode wraps the bottom side of the piezoresistive layer.

14. The device of claim 13 , wherein the second portions of the third and fourth electrodes are embedded in the insulator layer.

15. The device of claim 13 , wherein a distance in the transverse direction separates the second portions of the third and fourth electrodes on the bottom side of the piezoresistive layer from each other.

16. The device of claim 15 , wherein the insulator layer is in contact with the bottom side of the piezoresistive layer at the distance between the second portions of the third and fourth electrodes.

17. The device of claim 13 , wherein the first portions of the third and fourth electrodes have smaller yield strengths than the second portions of the third and fourth electrodes and the piezoresistive layer.

18. A piezoelectric device, comprising:
a first spacing layer;
a second spacing layer;
a first electrode disposed on the first spacing layer;
a second electrode disposed on the second spacing layer;
a piezoelectric layer, grown with 100 orientation, partially disposed on the first spacing layer and partially disposed on the second spacing layer, wherein the piezoelectric layer is disposed between the first electrode and the second electrode;
an insulator layer disposed on the piezoelectric layer;
a third electrode, having a first portion and a second portion, disposed on the insulator layer;
a piezoresistive layer, having a top, a bottom, a left, and a right side, disposed on the insulator layer;
a fourth electrode, having a first portion and a second portion, disposed on the insulator layer;
a semi-rigid housing, having a top, a bottom and two sides;
wherein the semi-rigid housing surrounds the piezoelectric layer, the piezoresistive layer, the insulator layer, the spacing layers, and the electrodes;
wherein the bottom of the semi-rigid housing is in contact with the first and second spacing layers, partial contact with the piezoelectric layer;
wherein the top of the semi-rigid housing is in contact with the third and fourth electrodes and the piezoresistive layer;
wherein between the two sides of the semi-rigid housing and the layers and the electrodes is a void;
wherein the first and second portion of the third electrode, the first and second portion of the fourth electrode, and the piezoresistive layer each have a yield strength; and
wherein an applied voltage across the first and second electrodes causes an expansion of the piezoelectric layer in the transverse direction whereby a pressure from the piezoelectric layer is applied to the piezoresistive layer through the insulator layer, such that an electrical resistance of the piezoresistive layer is dependent upon the pressure applied by the piezoelectric layer.

19. The device of claim 18 , wherein the third and fourth electrodes are coated with a layer of conducting film.

20. The device of claim 18 , wherein:
the first portion of the third electrode wraps the left side the piezoresistive layer;
the second portion of the third electrode is disposed on the top side of the piezoresistive layer;
the first portion of the fourth electrode wraps the right side of the piezoresistive layer;
the second portion of the fourth electrode is disposed on the top side of the piezoresistive layer; and
the top of the semi-rigid housing is in contact with the second portions of the third and fourth electrodes.

21. The device of claim 20 , wherein:
a distance in the transverse direction separates the second portions of the third and fourth electrodes on the top side of the piezoresistive layer from each other; and
the semi-rigid housing is in contact with the top side of the piezoresistive layer at the distance between the second portions of the electrodes.

22. The device of claim 20 , wherein between the semi-rigid housing and the first portions of the third and fourth electrode is a void.

23. The device of claim 20 , wherein:
the fir

Assignees

• IBM

Inventors

• Elmegreen Bruce G
• Kuroda Marcelo A
• Liu Xiao Hu
• Martyna Glenn J
• Newns Dennis M
• Solomon Paul M

Classifications

• H01L41/0986

  Electricity · mapped topic

• H01L49/00 Primary

  Electricity · mapped topic

• H10N30/206

  using only longitudinal or thickness displacement, e.g. d33 or d31 type devices · CPC title

• H10N99/00 Primary

  Subject matter not provided for in other groups of this subclass · CPC title

• H10N30/20 Primary

  with electrical input and mechanical output, e.g. functioning as actuators or vibrators · CPC title