Substrate transfer system and heat treatment apparatus using same

Patent metadata

Field	Value
Publication number	US-9939200-B2
Application number	US-201514948673-A
Country	US
Kind code	B2
Filing date	Nov 23, 2015
Priority date	Nov 25, 2014
Publication date	Apr 10, 2018
Grant date	Apr 10, 2018

Abstract

A substrate transfer system includes a substrate transfer part capable of transferring a substrate while holding the substrate, an elevating mechanism including a support axis extending in an upper-lower direction and being capable of moving the substrate transfer part along the support axis within a predetermined range, a first exhaust port located at a position selected from at least one of on the supporting axis and near the supporting axis above an upper limit of the predetermined range, a second exhaust port located at a position selected from at least one of on the supporting axis and near the supporting axis below a lower limit of the predetermined range, and an exhaust part connected such that exhaust is available through the first exhaust port and the second exhaust port.

First claim

What is claimed is:

1. A substrate transfer system comprising:
a substrate transfer part capable of transferring a substrate while holding the substrate;
an elevating mechanism including a support axis extending in an upper-lower direction and being capable of moving the substrate transfer part along the support axis within a predetermined range;
a first exhaust port located at a position selected from at least one of on the support axis and near the support axis above an upper limit of the predetermined range;
a second exhaust port located at a position selected from at least one of on the support axis and near the support axis below a lower limit of the predetermined range;
an exhaust part connected such that exhaust is available through the first exhaust port and the second exhaust port;
a first exhaust route located above the upper limit of the predetermined range; and
a second exhaust route located below the lower limit of the predetermined range,
wherein the first exhaust port and the second exhaust port are connected to the exhaust part through the first exhaust route and the second exhaust route, respectively.

2. The substrate transfer system of claim 1 , wherein the elevating mechanism is installed near a wall surface; and
wherein the first exhaust port and the second exhaust port are formed in a ceiling surface and a bottom surface which are near the wall surface, respectively.

3. The substrate transfer system of claim 2 , wherein the wall surface, the ceiling surface and the bottom surface are those of a substrate loading chamber into which the substrate is loaded from a substrate accommodation container accommodating the substrate.

4. The substrate transfer system of claim 3 , wherein the substrate accommodation container is a FOUP; and
wherein the substrate transfer part transfers the substrate from the FOUP installed in a predetermined position outside the substrate loading chamber.

5. The substrate transfer system of claim 3 , further comprising a cleaning filter,
wherein the exhaust part supplies a gas discharged through the first exhaust port and the second exhaust port to an interior of the substrate loading chamber via the cleaning filter so as to circulate the gas.

6. The substrate transfer system of claim 5 ,
wherein the cleaning filter is installed to face the wall surface; and
wherein the circulated gas is supplied towards the wall surface from the cleaning filter.

7. The substrate transfer system of claim 5 ,
wherein the exhaust part is an exhaust fan integrally formed with the cleaning filter.

8. The substrate transfer system of claim 5 ,
wherein the first exhaust route and the second exhaust route are installed outside the substrate loading chamber.

9. The substrate transfer system of claim 3 ,
wherein a substrate holder elevating mechanism is installed in the substrate loading chamber, a substrate holder capable of holding a plurality of substrates being able to be installed in the substrate holder elevating mechanism, and the substrate holder elevating mechanism capable of moving up and down the substrate holder; and
wherein the substrate transfer part transfers the plurality of the substrates from the substrate accommodation container to the substrate holder installed in the substrate holder elevating mechanism.

10. A heat treatment apparatus comprising:
the substrate transfer system of claim 9 ,
a processing container installed above the substrate holder elevating mechanism and capable of accommodating the substrate holder by raising the substrate holder elevating mechanism; and
a heater heating the processing container.

11. The substrate transfer system of claim 1 ,
wherein the support axis is a ball screw; and
wherein the elevating mechanism includes a driving mechanism rotating the ball screw.

12. The substrate transfer system of claim 1 ,
wherein the elevating mechanism is covered with a cover.

13. The substrate transfer system of claim 1 ,
wherein the substrate transfer part includes:
a fork part including a finger-shaped contact-holding portion which makes contact with the substrate and holds the substrate; and
an arm part supporting the fork part rotatably on a rotation axis, and
wherein an end portion of the arm part opposite to the contact-holding portion about the rotation axis includes a shape having no corner.

14. The substrate transfer system of claim 13 ,
wherein the shape having no corner is an arc shape.

Assignees

• Tokyo Electron Ltd

Inventors

• Hasegawa Koyu
• Ikeda Kyoko

Classifications

• H10P72/3412

  Batch transfer of wafers · CPC title

• H10P72/3402

  Mechanical parts of transfer devices · CPC title

• H10P72/0458

  vertical arrangement · CPC title

• H10P72/0402

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• H10P14/68

  Organic materials, e.g. photoresists · CPC title