System and method for monitoring wafer handling and a wafer handling machine

Patent metadata

Field	Value
Publication number	US-9442482-B2
Application number	US-201313872734-A
Country	US
Kind code	B2
Filing date	Apr 29, 2013
Priority date	Apr 29, 2013
Publication date	Sep 13, 2016
Grant date	Sep 13, 2016

Abstract

Systems, machines, and methods for monitoring wafer handling are disclosed herein. A system for monitoring wafer handling includes a sensor and a controller. The sensor is capable of being secured to an assembled wafer handling machine. The controller is in electronic communication with the sensor and includes control logic. The control logic is configured to store a reference output of the sensor when the wafer handling machine is aligned and is configured to generate an indication signal when a difference between the reference output and a current output of the sensor exceeds a threshold.

First claim

The invention claimed is:

1. A system for monitoring wafer handling, the system comprising:
a sensor capable of being secured to an assembled wafer handling machine;
an imaging device; and
a controller in electronic communication with the sensor and including control logic to:
store a reference output of the sensor when the wafer handling machine is aligned;
store a reference image from the imaging device that indicates a reference height of a component of the wafer handling machine during a portion of a handling cycle;
capture a verification image from the imaging device during the portion of another handling cycle; and
generate an indication signal when a difference between the reference output and a current output of the sensor during a wafer handling cycle exceeds a first threshold and when a difference between the reference image and the verification image indicates that a difference between the reference height and the height of the wafer handling component in the verification image exceeds a second threshold.

2. The system of claim 1 wherein the system includes a tilt sensor secured to an assembled wafer handling machine.

3. The system of claim 2 wherein the sensor comprises a plurality of sensors including a vibration sensor, a temperature sensor, and a harmonics sensor.

4. The system of claim 1 wherein the controller further includes control logic to command inhibition of automated delivery of semiconductor wafers to the wafer handling machine based on the indication signal.

5. The system of claim 1 wherein the controller further includes a wireless modem for communicating the indication signal.

6. The system of claim 1 wherein the controller further includes a button, and wherein the control logic is further configured to store the reference output when the button is pressed.

7. A wafer handling machine comprising:
a load port capable of holding wafers;
a robotic arm capable of picking up and moving the wafers;
a sensor secured to an outside of at least one of the load port and the robotic arm;
an imaging device;
a controller including control logic to:
store a reference image from the imaging device when the robotic arm is at a reference height during a portion of a handling cycle;
capture a verification image from the imaging device during the portion of another handling cycle; and
store a reference output of the sensor when the wafer handling machine is aligned; and
generate an indication signal when a difference between the reference output and a current output of the sensor during a wafer handling cycle exceeds a first threshold and when a difference between the reference image and the verification image indicates that a difference between the reference height and the height of the robotic arm in the verification image exceeds a second threshold; and

an automation control module for controlling movement of the robotic arm, wherein the automation control module is separate from the controller.

8. The wafer handling machine of claim 7 wherein the sensor includes a tilt sensor.

9. The wafer handling machine of claim 7 wherein the sensor comprises a plurality of sensors including a vibration sensor, a temperature sensor, and a harmonics sensor.

10. The wafer handling machine of claim 7 wherein the controller further includes control logic command inhibition of automated delivery of semiconductor wafers to the wafer handling machine based on the indication signal.

11. The wafer handling machine of claim 7 wherein the controller further includes a wireless modem for communicating the indication signal.

12. The wafer handling machine of claim 7 wherein the controller further includes a button, and wherein the control logic is further configured to store the reference output when the button is pressed.

13. A method of monitoring wafer handling, the method comprising:
securing an imaging device to the assembled semiconductor wafer handling machine;
storing a reference image from the imaging device when a wafer handling component of the wafer handling machine is at a reference height during a portion of a handling cycle;
capturing a verification image from the imaging device during the portion of another handling cycle;
storing a reference output of a sensor when a wafer handling machine is aligned, wherein the sensor is secured to the wafer handling machine;
operating the wafer handling machine for a wafer handling cycle; and
generating an indication signal when a difference between the reference output and a current output of the sensor exceeds a first threshold during the wafer handling cycle of the wafer handling machine; and
generating the indication signal when a difference between the reference image and the verification image indicates that a difference between the reference height and the height of the wafer handling component in the verification image exceeds a second threshold.

14. The method of claim 13 further comprising securing the sensor to a component of an assembled semiconductor wafer handling machine.

15. The method of claim 14 wherein securing the sensor further includes securing at least one of a tilt sensor, a vibration sensor, a temperature sensor, and a harmonics sensor.

16. The method of claim 13 further comprising inhibiting automated delivery of semiconductor wafers to the wafer handling machine based on the indication signal.

17. The method of claim 13 further comprising securing a tilt sensor to a robotic arm of the wafer handling machine and includes securing a tilt sensor to a load port of the wafer handling machine.

Assignees

• Globalfoundries Inc

Inventors

• Miner Stephen Bradley
• Fosnight William John
• Gallagher Ryan

Classifications

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10P72/1924

  characterised by atmosphere control · CPC title

• H10P72/0606 Primary

  Position monitoring, e.g. misposition detection or presence detection · CPC title

• H10P72/50

  for positioning, orientation or alignment · CPC title

• H10P72/0608 Primary

  of substrates stored in a container, a magazine, a carrier, a boat or the like · CPC title