Epoxy compound, epoxy resin, curable compound, cured product thereof, semiconductor sealing material, and printed circuit board
US-2016369041-A1 · Dec 22, 2016 · US
US9932438B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9932438-B2 |
| Application number | US-201214363862-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 7, 2012 |
| Priority date | Dec 16, 2011 |
| Publication date | Apr 3, 2018 |
| Grant date | Apr 3, 2018 |
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Epoxy compounds that are bisanhydrohexitol derivatives (i.e., isosorbide derivatives, isomannide derivatives, isoidide derivatives, or mixtures thereof) having two terminal oxirane groups are provided. Additionally, curable compositions that include these epoxy compounds, cured compositions prepared from the curable compositions, and articles containing the cured compositions are described. The cured compositions can be used, for example, as a structural adhesive or as a coating.
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We claim: 1. A compound that is
heterocyclic · CPC title
As intermediate layer · CPC title
heterocyclic · CPC title
carbocyclic · CPC title
aliphatic · CPC title
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