Epoxy resin composition, and film, prepreg, and fiber-reinforced plastic using same

Patent metadata

Field	Value
Publication number	US-2016297959-A1
Application number	US-201415100556-A
Country	US
Kind code	A1
Filing date	Dec 2, 2014
Priority date	Dec 2, 2013
Publication date	Oct 13, 2016
Grant date	—

Abstract

Provided are an epoxy resin composition which contains an epoxy resin and a curing agent, and satisfies the following (1), (2), and (3):
(1) the bending elastic modulus of a cured product of the epoxy resin composition is 3.3 GPa or higher; (2) the bending strain at break of the cured product of the epoxy resin composition is 9% or higher; and (3) the fiber-reinforced plastic α formed of the cured product of the epoxy resin composition and a reinforcing fiber substrate in which carbon fibers, which are continuous fibers, are evenly aligned in one direction has 90° bending strength of 95 MPa or higher, and a film, a prepreg, and fiber-reinforced plastic that are produced by using the epoxy resin composition.

First claim

1 : An epoxy resin composition, comprising an epoxy resin and a curing agent, and satisfying the following (1), (2), and (3):
(1) a bending elastic modulus of a cured product of the epoxy resin composition is 3.3 GPa or higher; (2) a bending strain at break of the cured product of the epoxy resin composition is 9% or higher; and (3) a fiber-reinforced plastic α formed of the cured product of the epoxy resin composition and a reinforcing fiber substrate in which carbon fibers, which are continuous fibers, are evenly aligned in one direction has 90° bending strength of 95 MPa or higher.

2 : The epoxy resin composition according to claim 1 , wherein the 90° bending strain at break of the fiber-reinforced plastic α is 1.3% or higher.

3 : An epoxy resin composition, comprising an epoxy resin and a curing agent, and satisfying the following (1), (2), and (4):
(1) a bending elastic modulus of a cured product of the epoxy resin composition is 3.3 GPa or higher; (2) a bending strain at break of the cured product of the epoxy resin composition is 9% or higher; and (4) a tensile lap-shear strength is 9.5 MPa or higher when measurement is made based on JIS K 6850 by using A5052 aluminum as a subject for adhesion.

4 : The epoxy resin composition according to claim 1 , wherein the epoxy resin comprises:
(A) an oxazolidone ring-containing epoxy resin, which is not a glycidylamine epoxy resin; (B-1) a glycidylamine epoxy resin not having an oxazolidone ring; (C) a bisphenol bifunctional epoxy resin having the number average molecular weight of 600 or more, which does not have oxazolidone ring and is not a glycidylamine epoxy resin; (D) a phenoxy resin; and (E) a curing agent.

5 : The epoxy resin composition according to claim 1 , wherein the epoxy resin comprises:
(A) an oxazolidone ring-containing epoxy resin, which is not a glycidylamine epoxy resin; (B-2) glycidylphthalimide; (C) a bisphenol bifunctional epoxy resin having the number average molecular weight of 600 or more, which does not have an oxazolidone ring and is not a glycidylamine epoxy resin; (D) a phenoxy resin; and (E) a curing agent.

6 : An epoxy resin composition, comprising:
(A) an oxazolidone ring-containing epoxy resin, which is not a glycidylamine epoxy resin; (B-1) a glycidylamine epoxy resin not having an oxazolidone ring; (C) a bisphenol bifunctional epoxy resin having the number average molecular weight of 600 or more, which does not have an oxazolidone ring and is not a glycidylamine epoxy resin; (D) a phenoxy resin; (E) a curing agent; and (G) a low viscosity epoxy resin, which does not contain an oxazolidone ring and is neither a diglycidylamine epoxy resin nor glycidylphthalimide, wherein a total amount of the components (A), (B-1), (C), and (G) is 75 parts by mass or more relative to 100 parts by mass of a total amount of the epoxy resin contained in the epoxy resin composition.

7 : An epoxy resin composition, comprising:
(A) an oxazolidone ring-containing epoxy resin, which is not a glycidylamine epoxy resin; (B-2) glycidylphthalimide; (C) a bisphenol bifunctional epoxy resin having the number average molecular weight of 600 or more, which does not have oxazolidone ring and is not a glycidylamine epoxy resin; (D) a phenoxy resin; (E) a curing agent; and (G) a low viscosity epoxy resin, which does not contain an oxazolidone ring and is neither a diglycidylamine epoxy resin nor glycidylphthalimide, wherein a total amount of the components (A), (B-2), (C), and (G) is 75 parts by mass or more relative to 100 parts by mass of a total amount of the epoxy resin contained in the epoxy resin composition.

8 : A film, comprising the epoxy resin composition according to claim 1 .

9 : A prepreg having the epoxy resin composition according to claim 1 impregnated in a reinforcing fiber substrate.

10 : A fiber-reinforced plastic, comprising a cured product of the epoxy resin composition according to claim 1 and a reinforcing fiber.

11 : The fiber-reinforced plastic according to claim 10 having a tubular shape.

Assignees

• Mitsubishi Rayon Co

Inventors

• Ishimoto Tomoko
• Kaneko Manabu
• Atsumi Tetsuya
• Watanabe Kenichi

Classifications

• C08J2471/00

  Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers · CPC title

• C08G59/245

  aromatic · CPC title

• C08L2205/03

  containing three or more polymers in a blend · CPC title

• C08L63/00 Primary

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08J2463/02

  Polyglycidyl ethers of bis-phenols · CPC title