Resist underlayer film formation composition and method for forming resist pattern using the same

Patent metadata

Field	Value
Publication number	US-9448480-B2
Application number	US-201415023823-A
Country	US
Kind code	B2
Filing date	Sep 22, 2014
Priority date	Sep 27, 2013
Publication date	Sep 20, 2016
Grant date	Sep 20, 2016

Abstract

The present invention provides a novel resist underlayer film formation composition for lithography. A resist underlayer film formation composition for lithography comprising: a polymer having a structure of Formula (1) at a terminal of a polymer chain; a cross-linking agent; a compound promoting a cross-linking reaction; and an organic solvent;

(where R 1 , R 2 , and R 3 are each independently a hydrogen atom, a linear or branched C 1-13 alkyl group, a halogeno group, or a hydroxy group; at least one of R 1 , R 2 , and R 3 is the alkyl group; Ar is a benzene ring, a naphthalene ring, or an anthracene ring; two carbonyl groups are bonded to respective two adjacent carbon atoms of Ar; and X is a linear or branched C 1-6 alkyl group optionally having a C 1-3 alkoxy group as a substituent).

First claim

The invention claimed is:

1. A resist underlayer film formation composition for lithography comprising:
a polymer having a structure of Formula (1) at a terminal of a polymer chain;
a cross-linking agent;
a compound promoting a cross-linking reaction; and
an organic solvent:

(where R 1 , R 2 , and R 3 are each independently a hydrogen atom, a linear or branched C 1-13 alkyl group, a halogeno group, or a hydroxy group; at least one of R 1 , R 2 , and R 3 is the alkyl group; Ar is a benzene ring, a naphthalene ring, or an anthracene ring; two carbonyl groups are bonded to respective two adjacent carbon atoms of Ar; and X is a linear or branched C 1-6 alkyl group optionally having a C 1-3 alkoxy group as a substituent).

2. The resist underlayer film formation composition for lithography according to claim 1 , wherein the polymer is a reaction product of material monomers containing a compound of Formula (1a) and a compound of Formula (1b):

(where R 1 , R 2 , R 3 , Ar, and X mean the same as those of Formula (1)).

3. The resist underlayer film formation composition for lithography according to claim 1 , wherein the polymer has structural units of Formula (2) and Formula (3):

(where Q 1 and Q 2 are each independently a divalent group having a linear or branched C 1-13 hydrocarbon group, a divalent group having an alicyclic hydrocarbon group, a divalent group having an aromatic ring, or a divalent group having a heterocycle including 1 to 3 nitrogen atoms; and the hydrocarbon group, the alicyclic hydrocarbon group, the aromatic ring, and the heterocycle optionally have at least one substituent).

4. The resist underlayer film formation composition for lithography according to claim 3 , wherein the structural unit of Formula (2) is represented by Formula (2′):

(where Q 3 is a linear or branched C 1-13 hydrocarbon group, a divalent group having an alicyclic hydrocarbon group, or a divalent group having an aromatic ring; the hydrocarbon group, the alicyclic hydrocarbon group, and the aromatic ring optionally have at least one substituent; and two v are each independently 0 or 1).

5. The resist underlayer film formation composition for lithography according to claim 3 , wherein the structural unit of Formula (3) is represented by Formula (3′):

(where Q 4 is a linear or branched C 1-13 hydrocarbon group, an alicyclic hydrocarbon group, or an aromatic ring; the hydrocarbon group, the alicyclic hydrocarbon group, and the aromatic ring optionally have at least one substituent; the hydrocarbon group optionally has one or two sulfur atoms and optionally has a double bond in a main chain of the hydrocarbon group; and two w are each independently 0 or 1).

6. The resist underlayer film formation composition for lithography according to claim 3 , wherein the polymer is represented by Formula (4):

(where R 1 , R 2 , R 3 , Ar, and X mean the same as those of Formula (1); and Y is a polymer chain having the structural units of Formula (2) and Formula (3)).

7. The resist underlayer film formation composition for lithography according to claim 1 , wherein the polymer has a weight-average molecular weight of 1,000 to 100,000.

8. The resist underlayer film formation composition for lithography according to claim 1 , wherein the organic solvent is one solvent or a combination of two or more solvents selected from the group consisting of propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, 1-ethoxy-2-propanol, ethyl lactate, butyl lactate, and cyclohexanone.

9. The resist underlayer film formation composition for lithography according to claim 1 , further comprising an acid generator.

10. A method for forming a resist pattern, the method comprising steps of:
applying the resist underlayer film formation composition for lithography as claimed in claim 1 onto a semiconductor substrate and baking the composition to form a resist underlayer film having a thickness of 1 nm to 20 nm;
forming a resist film on the resist underlayer film;
exposing the semiconductor substrate coated with the resist underlayer film and the resist film to radiation selected from the group consisting of a KrF excimer laser, an ArF excimer laser, extreme-ultraviolet rays, and electron beams; and
developing the substrate with an alkaline liquid developer after the exposure.

Assignees

• Nissan Chemical Ind Ltd

Inventors

• Nishita Tokio
• Ohnishi Ryuji
• Fujitani Noriaki
• Sakamoto Rikimaru

Classifications

• H10P76/2043

  using an anti-reflective coating · CPC title

• C08G59/308

  containing halogen atoms · CPC title

• C08G59/245

  aromatic · CPC title

• G03F7/11 Primary

  having cover layers or intermediate layers, e.g. subbing layers {(G03F7/091 - G03F7/093, B41N3/03 take precedence)} · CPC title

• G03F7/094

  Multilayer resist systems, e.g. planarising layers · CPC title