Phosphorus-containing epoxy resin, epoxy resin composition, prepreg, laminated plate, material for circuit board and cured product
US-11421071-B2 · Aug 23, 2022 · US
heterocyclic
heterocyclic · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08G59/5046 |
| Official title | {heterocyclic} |
| Display label | heterocyclic |
| Total patents | 93 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 5 |
| 2016 | 5 |
| 2017 | 7 |
| 2018 | 3 |
| 2019 | 17 |
| 2020 | 9 |
| 2021 | 9 |
| 2022 | 11 |
| 2023 | 9 |
| 2024 | 10 |
| 2025 | 6 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Underfill film for semiconductor package and method for manufacturing semiconductor package using the same
US-2022199430-A1 · Jun 23, 2022 · US
Fast-curing epoxy systems
US-11359048-B2 · Jun 14, 2022 · US
Composition, cured product, method for manufacturing cured product, method for manufacturing coating film, and method for manufacturing composition
US-2022106436-A1 · Apr 7, 2022 · US
Fast-curing epoxy systems
US-11286335-B2 · Mar 29, 2022 · US
Curable resin composition, and film, molded article, prepreg, and fiber-reinforced plastic using said curable resin composition
US-2021403701-A1 · Dec 30, 2021 · US
Blend for curing epoxy resin composistions
US-11198756-B2 · Dec 14, 2021 · US
Curable resin composition, and film, molded article, prepreg, and fiber-reinforced plastic using said curable resin composition
US-11161975-B2 · Nov 2, 2021 · US
Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device
US-2021301076-A1 · Sep 30, 2021 · US
Use of heterocyclic amines containing primary or secondary amines as a polymer catalyst or hardener
US-2021261721-A1 · Aug 26, 2021 · US
Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed circuit board
US-11098195-B2 · Aug 24, 2021 · US
Phosphorus-containing epoxy resin, epoxy resin composition, prepreg, laminated plate, material for circuit board and cured product
US-2021253783-A1 · Aug 19, 2021 · US
Heat-curable resin composition for semiconductor encapsulation and semiconductor device
US-11046848-B2 · Jun 29, 2021 · US
Thermally conductive resin composition
US-2021087329-A1 · Mar 25, 2021 · US
Thermosetting resin composition, and prepreg and substrate using same
US-10774173-B2 · Sep 15, 2020 · US
Liquid resin composition for sealing and electronic component apparatus
US-2020194325-A1 · Jun 18, 2020 · US
Fast-curing epoxy systems
US-2020172723-A1 · Jun 4, 2020 · US
Renewable furan based amine curing agents for epoxy thermoset
US-2020172658-A1 · Jun 4, 2020 · US
Thermosetting resin composition, thermosetting sheet, semiconductor component, and semiconductor mounted article
US-2020172666-A1 · Jun 4, 2020 · US
Thermally conductive material, device with thermally conductive layer, composition for forming thermally conductive material, and disk-like liquid crystal compound
US-2020148931-A1 · May 14, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08G59/5046?
- CPC C08G59/5046 is the Cooperative Patent Classification code for “heterocyclic.”
- How many patents are filed under CPC C08G59/5046 (heterocyclic)?
- Our database includes 93 publications tagged with this CPC code.
- Is patent activity under CPC C08G59/5046 growing?
- Publication counts under this code: 10 in 2024 vs 6 in 2025 (latest complete years).